Ept hm 2.0 female Type B22 110P. class 2 Content: 1 pc(s) 244-22000-15 Information Guide
Product codes
244-22000-15
32
ept GmbH
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Phone +49 (0) 88 61 / 25 01 0
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Fax +49 (0) 88 61 / 55 07
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E-mail sales@ept.de
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www.ept.de
hm connectors
Hole specifi cations
Hole specifi cations
Plated through-hole according to IEC 60352-5
ept offers adapted press-fi t zones for
various new board surfaces.
various new board surfaces.
Nominal hole
Ø 0.6 mm
imm. Sn printed circuit boards
A
PCB thickness
min. 1.4 mm
B
Plated hole
Ø 0.60
± 0.05 mm
C
Drill hole
0.70
± 0.02 mm
D
Cu plating
min. 25 μm
E
Imm. Sn plating
max. 1.5 μm
F
Annular ring
min. 0.1 mm
Ni, Au printed circuit boards
A
PCB thickness
min. 1.4 mm
B
Plated hole
Ø 0.60
± 0.05 mm
C
Drill hole
0.70
± 0.02 mm
D
Cu plating
min. 25 μm
E
Ni, Au plating
0.05 – 0.2 μm Au
over 2.5 – 5 μm Ni
F
Annular ring
min. 0.1 mm
pure Cu printed circuit boards
A
PCB thickness
min. 1.4 mm
B
Plated hole
Ø 0.60
± 0.05 mm
C
Drill hole
0.70
± 0.02 mm
D
Cu plating
min. 25 μm
E
OSP*
e. g. GLICOAT-SMD (F2)
with 0.12 – 0.15 μm
F
Annular ring
min. 0.1 mm
HAL Sn printed circuit boards
A
PCB thickness
min. 1.4 mm
B
Plated hole
Ø 0.60
± 0.05 mm
C
Drill hole
0.70
± 0.02 mm
D
Cu plating
min. 25 μm
E
HAL Sn
5 – 15 μm
F
Annular ring
min. 0.1 mm
* OSP = Organic Solderability Preservatives