Panasonic AQ10A2ZT432 Semiconductor Relay AQ10A2ZT432 Data Sheet

Product codes
AQ10A2ZT432
Page of 6
AQ1
6
ds_61601_0001_en_aq1: 060207D
CAUTIONS FOR USE
1. Input side
1) Noise and surge protection at the input 
side
A high noise surge voltage applied to the 
SSR input circuit can cause malfunction 
or permanent damage to the device. If 
such a high surge is anticipated, use C or 
R noise absorber in the input circuit.
2) When the input terminals are 
connected with reverse polarity
Reversing the polarity will not cause 
damage to the device, due to the 
presence of a protection diode, but the 
device will not operate.
3) In the case of operating voltage 
containing ripple
If the SSR control voltage contains ripple, 
the peak of the ripple should not exceed 
the maximum rated control voltage “32V”, 
and the bottom of the ripple should 
exceed the minimum rated control 
voltage “4V”.
2. Output side
1) Regarding output noise surge 
protection
A high noise surge voltage applied to the 
SSR load circuit can cause malfunction 
or permanent damage to the device. If 
such a high surge is anticipated, use a 
varistor across the SSR output.
Keep the varistor voltage to no more than 
500 V.
2) When used for the load less than rated
An SSR may malfunction if it is used 
below the specified load. In such an 
event, use a dummy resistor in parallel 
with the load.
Set a value of dummy resistor so that the 
load current becomes 50 mA or greater 
due to the dummy resister and load.
3. When using bent output terminals
To avoid applying mechanical stress on 
the main unit and molded section of the 
solid state relay, radio pliers should be 
used to grasp the terminals between the 
point of bending and the molded case 
when making the bends.
4. When a heat sink is mounted on the 
5 A or 10 A type
The heat sink (AQ-HS-5A) or a radiator 
which can make good contact should be 
used.
If a heat sink is used in which the contact 
condition is bad, a heat conducting 
compound should be used to improve the 
heat radiation. (Ex. Silicon compound 
Toshiba silicon YG6111 or TSK5303) The 
compound should be applied between 
the heat sink and the AQ1.
5. Others
1) If an SSR is used in close proximity to 
another SSR or heat-generating device, 
its ambient temperature may exceed the 
allowable level. Carefully plan SSR 
layout and ventilation.
2) Soldering to SSR terminals should be 
completed within 5 seconds at 260
°C 
500
°F
.
3) Terminal connections should be made 
by referring to the associated wiring 
diagram.
4) For higher reliability, check device 
quality under actual operating conditions.
6. Transportation and storage
1) Extreme vibration during transport will 
warp the lead or damage the relay. 
Handle the outer and inner boxes with 
care.
2) Storage under extreme conditions will 
cause soldering degradation, external 
appearance defects, and deterioration of 
the characteristics. The following storage 
conditions are recommended:
• Temperature: 5 to 30
°C 
41 to 86
°F
• Humidity: Less than 60% R.H.
• Atmosphere: No harmful gasses such 
as sulfurous acid gas, minimal dust.
SSR
3
4
Control
voltage
source
R
C
Peak ripple voltage
Valley ripple voltage
0 V
Load
power
supply
Load
SSR
1
2
Varistor
Load
power
supply
Load
SSR
1
2
R
0
 (dummy resistor)
Solid state relay
Terminal bend section
Printed circuit board
Solder
AQ-HS-5A heat sink
(provided with AQ-HS-5A)
Printed circuit board
Approx. 0.6N·m of torque should be
used for tightening the M3 screws.
5 A or 10 A type AQ1 SSR
4-M3 screws