IBM Intel Xeon X7350 44E4243 Data Sheet
Product codes
44E4243
Document Number: 318080-002
15
Electrical Specifications
2
Electrical Specifications
2.1
Front Side Bus and GTLREF
Most Intel
®
Xeon
®
Processor 7200 Series and 7300 Series FSB signals use Assisted
Gunning Transceiver Logic (AGTL+) signaling technology. This technology provides
improved noise margins and reduced ringing through low voltage swings and controlled
edge rates. AGTL+ buffers are open-drain and require pull-up resistors to provide the
high logic level and termination. AGTL+ output buffers differ from GTL+ buffers with
the addition of an active PMOS pull-up transistor to “assist” the pull-up resistors during
the first clock of a low-to-high voltage transition. Platforms implement a termination
voltage level for AGTL+ signals defined as V
improved noise margins and reduced ringing through low voltage swings and controlled
edge rates. AGTL+ buffers are open-drain and require pull-up resistors to provide the
high logic level and termination. AGTL+ output buffers differ from GTL+ buffers with
the addition of an active PMOS pull-up transistor to “assist” the pull-up resistors during
the first clock of a low-to-high voltage transition. Platforms implement a termination
voltage level for AGTL+ signals defined as V
TT
. Because platforms implement separate
power planes for each processor (and chipset), separate V
CC
and V
TT
supplies are
necessary. This configuration allows for improved noise tolerance as processor
frequency increases. Speed enhancements to data and address buses have made
signal integrity considerations and platform design methods even more critical than
with previous processor families. Design guidelines for the processor FSB are detailed
in the appropriate platform design guidelines (refer to
frequency increases. Speed enhancements to data and address buses have made
signal integrity considerations and platform design methods even more critical than
with previous processor families. Design guidelines for the processor FSB are detailed
in the appropriate platform design guidelines (refer to
The AGTL+ inputs require reference voltages (GTLREF_DATA_MID,
GTLREF_DATA_END, GTLREF_ADD_MID and GTLREF_ADD_END) which are used by the
receivers to determine if a signal is a logical 0 or a logical 1. GTLREF_DATA_MID and
GTLREF_DATA_END are used for the 4X front side bus signaling group and
GTLREF_ADD_MID and GTLREF_ADD_END are used for the 2X and common clock front
side bus signaling groups. GTLREF_DATA_MID, GTLREF_DATA_END,
GTLREF_ADD_MID, and GTLREF_ADD_END must be generated on the baseboard (See
GTLREF_DATA_END, GTLREF_ADD_MID and GTLREF_ADD_END) which are used by the
receivers to determine if a signal is a logical 0 or a logical 1. GTLREF_DATA_MID and
GTLREF_DATA_END are used for the 4X front side bus signaling group and
GTLREF_ADD_MID and GTLREF_ADD_END are used for the 2X and common clock front
side bus signaling groups. GTLREF_DATA_MID, GTLREF_DATA_END,
GTLREF_ADD_MID, and GTLREF_ADD_END must be generated on the baseboard (See
for GTLREF_DATA_MID, GTLREF_DATA_END, GTLREF_ADD_MID and
GTLREF_ADD_END specifications). Refer to the applicable platform design guidelines
for details. Termination resistors (R
for details. Termination resistors (R
TT
) for AGTL+ signals are provided on the processor
silicon and are terminated to VTT. The on-die termination resistors are always enabled
on the processor to control reflections on the transmission line. Intel chipsets also
provide on-die termination, thus eliminating the need to terminate the bus on the
baseboard for most AGTL+ signals.
on the processor to control reflections on the transmission line. Intel chipsets also
provide on-die termination, thus eliminating the need to terminate the bus on the
baseboard for most AGTL+ signals.
Some FSB signals do not include on-die termination (R
TT
) and must be terminated on
for details regarding these signals.
The AGTL+ bus depends on incident wave switching. Therefore, timing calculations for
AGTL+ signals are based on flight time as opposed to capacitive deratings. Analog
signal simulation of the FSB, including trace lengths, is highly recommended when
designing a system. Contact your Intel Field Representative to obtain the processor
signal integrity models, which includes buffer and package models.
AGTL+ signals are based on flight time as opposed to capacitive deratings. Analog
signal simulation of the FSB, including trace lengths, is highly recommended when
designing a system. Contact your Intel Field Representative to obtain the processor
signal integrity models, which includes buffer and package models.
2.2
Decoupling Guidelines
Due to its large number of transistors and high internal clock speeds, the processor is
capable of generating large average current swings between low and full power states.
This may cause voltages on power planes to sag below their minimum values if bulk
decoupling is not adequate. Larger bulk storage (CBULK), such as electrolytic
capacitors, supply current during longer lasting changes in current demand by the
component, such as coming out of an idle condition. Similarly, they act as a storage
well for current when entering an idle condition from a running condition. Care must be
taken in the baseboard design to ensure that the voltage provided to the processor
capable of generating large average current swings between low and full power states.
This may cause voltages on power planes to sag below their minimum values if bulk
decoupling is not adequate. Larger bulk storage (CBULK), such as electrolytic
capacitors, supply current during longer lasting changes in current demand by the
component, such as coming out of an idle condition. Similarly, they act as a storage
well for current when entering an idle condition from a running condition. Care must be
taken in the baseboard design to ensure that the voltage provided to the processor