IBM Intel Xeon X7350 44E4243 Data Sheet

Product codes

44E4243

Document Number: 318080-002

Thermal Specifications

6.1

Package Thermal Specifications

The Intel

Xeon

Processor 7200 Series and 7300 Series requires a thermal solution to

maintain temperatures within its operating limits. Any attempt to operate the processor
outside these operating limits may result in permanent damage to the processor and
potentially other components within the system. As processor technology changes,
thermal management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation.

A complete solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.

This section provides data necessary for developing a complete thermal solution. For
more information on designing a component level thermal solution, refer to the Dual-
Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon® Processor
7300 Series Thermal / Mechanical Design Guide.

6.1.1

Thermal Specifications

To allow the optimal operation and long-term reliability of Intel processor-based
systems, the processor must remain within the minimum and maximum case
temperature (TCASE) specifications as defined by the applicable thermal profile (see

Table 6-1

and

Figure 6-1

for Quad-Core Intel® Xeon® Processor E7300 Series,

Table 6-3

and

Figure 6-2

for Quad-Core Intel® Xeon® X7350 Processor,

Table 6-5

and

Figure 6-3

for Quad-Core Intel® Xeon® L7345 Processor,

Dual-Core Intel® Xeon® Processor 7200 Series). Thermal solutions not designed to
provide this level of thermal capability may affect the long-term reliability of the
processor and system. For more details on thermal solution design, please refer to the
Dual-Core Intel® Xeon® Processor 7200 Series and Quad-Core Intel® Xeon®
Processor 7300 Series Thermal / Mechanical Design Guide.

The Intel

Xeon

Processor 7200 Series and 7300 Series implement a methodology for

managing processor temperatures which is intended to support acoustic noise
reduction through fan speed control and to assure processor reliability. Selection of the
appropriate fan speed is based on the relative temperature data reported by the
processor’s Platform Environment Control Interface (PECI) bus as described in

Section 6.3

. The temperature reported over PECI is always a negative value and

represents a delta below the onset of thermal control circuit (TCC) activation, as
indicated by PROCHOT# (see

Section 6.2

, Processor Thermal Features). Systems that

implement fan speed control should be designed to use this data. Systems that do not
alter the fan speed also need to guarantee the case temperature meets the thermal
profile specifications.

The Quad-Core Intel® Xeon® Processor E7300 Series (see

Figure 6-1

;

Table 6-2

Quad-Core Intel® Xeon® L7345 Processor (see

Figure 6-3

;

Table 6-6

) and Dual-Core

Intel® Xeon® Processor 7200 Series (see

Figure 6-4

;

Table 6-8

) supports a single

Thermal Profile. The Thermal Profile is indicative of a constrained thermal environment
(Ex: 1U form factor). Because of the reduced cooling capability represented by this
solution, the probability of TCC activation and performance loss is increased.