IBM Intel Xeon E5430 43W3994 Data Sheet
Product codes
43W3994
105
Boxed Processor Specifications
Notes:
1.
The heat sinks represented in these images are for reference only, and may not represent the final boxed
processor heat sinks.
2.
The screws, springs, and standoffs will be captive to the heat sink. This image shows all of the components
in an exploded view.
3.
It is intended that the CEK spring will ship with the base board and be pre-attached prior to shipping.
8.2
Mechanical Specifications
This section documents the mechanical specifications of the boxed processor.
8.2.1
Boxed Processor Heat Sink Dimensions (CEK)
The boxed processor will be shipped with an unattached thermal solution. Clearance is
required around the thermal solution to ensure unimpeded airflow for proper cooling.
The physical space requirements and dimensions for the boxed processor and
assembled heat sink are shown in
required around the thermal solution to ensure unimpeded airflow for proper cooling.
The physical space requirements and dimensions for the boxed processor and
assembled heat sink are shown in
.
through
connector used for the active CEK fan heat sink solution.
Figure 8-3. 2U Passive Quad-Core Intel® Xeon® Processor 5400 Series
Thermal Solution (Exploded View)