IBM Intel Xeon E5430 43W3994 Data Sheet

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The Quad-Core Intel® Xeon® Processor 5400 Series is packaged in a Flip Chip Land 
Grid Array (FC-LGA) package that interfaces to the baseboard via a LGA771 socket. The 
package consists of a processor core mounted on a pinless substrate with 771 lands. An 
integrated heat spreader (IHS) is attached to the package substrate and core and 
serves as the interface for processor component thermal solutions such as a heatsink. 

 shows a sketch of the processor package components and how they are 

assembled together. Refer to the LGA771 Socket Design Guidelines for complete details 
on the LGA771 socket.

The package components shown in 

• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor Core (die)
• Package Substrate
• Landside capacitors
• Package  Lands

This drawing is not to scale and is for reference only.

The package mechanical drawings are shown in 

. The 

drawings include dimensions necessary to design a thermal solution for the processor 
including:

• Package reference and tolerance dimensions (total height, length, width, and so 

forth)

• IHS parallelism and tilt
• Land dimensions
• Top-side and back-side component keepout dimensions
• Reference datums

All drawing dimensions are in mm [in.].