IBM Intel Xeon E5430 43W3994 Data Sheet
Product codes
43W3994
Thermal Specifications
90
6.1.2
Thermal Metrology
The minimum and maximum case temperatures (T
CASE
) are specified in
, and
are measured at the
geometric top center of the processor integrated heat spreader (IHS).
illustrates the location where T
CASE
temperature measurements should be made. For
detailed guidelines on temperature measurement methodology, refer to the Quad-Core
Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines (TMDG).
Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines (TMDG).
Note:
Figure is not to scale and is for reference only.
6.2
Processor Thermal Features
6.2.1
Intel
®
Thermal Monitor Features
Quad-Core Intel® Xeon® Processor 5400 Series provides two thermal monitor
features, Intel® Thermal Monitor 1 and Intel® Thermal Monitor 2. The Intel® Thermal
Monitor 1 and Intel® Thermal Monitor 2 must both be enabled in BIOS for the
processor to be operating within specifications. When both are enabled, Intel® Thermal
Monitor 2 will be activated first and Intel® Thermal Monitor 1 will be added if Intel®
Thermal Monitor 2 is not effective.
features, Intel® Thermal Monitor 1 and Intel® Thermal Monitor 2. The Intel® Thermal
Monitor 1 and Intel® Thermal Monitor 2 must both be enabled in BIOS for the
processor to be operating within specifications. When both are enabled, Intel® Thermal
Monitor 2 will be activated first and Intel® Thermal Monitor 1 will be added if Intel®
Thermal Monitor 2 is not effective.
6.2.1.1
Intel® Thermal Monitor 1
The Intel® Thermal Monitor 1 feature helps control the processor temperature by
activating the Thermal Control Circuit (TCC) when the processor silicon reaches its
maximum operating temperature. The TCC reduces processor power consumption as
activating the Thermal Control Circuit (TCC) when the processor silicon reaches its
maximum operating temperature. The TCC reduces processor power consumption as
Figure 6-6. Case Temperature (T
CASE
) Measurement Location