IBM Quad-Core Intel Xeon E5405 44R5630 User Manual
Product codes
44R5630
Quad-Core Intel® Xeon® Processor 5400 Series TMDG
39
Thermal/Mechanical Reference Design
2.5.4
Assembly Overview of the Intel Reference Thermal
Mechanical Design
The reference design heatsinks that meet the Quad-Core Intel® Xeon® Processor 5400
Series thermal performance targets are called the Common Enabling Kit (CEK)
heatsinks, and are available in 1U, 2U, & 2U+ form factors. Each CEK consists of the
following components:
Series thermal performance targets are called the Common Enabling Kit (CEK)
heatsinks, and are available in 1U, 2U, & 2U+ form factors. Each CEK consists of the
following components:
• Heatsink (with captive standoff and screws)
• Thermal Interface Material (TIM)
• CEK Spring
• Thermal Interface Material (TIM)
• CEK Spring
2.5.4.1
Geometric Envelope
The baseboard keepout zones on the primary and secondary sides and height
restrictions under the enabling component region are shown in detail in
restrictions under the enabling component region are shown in detail in
.
The overall volumetric keep in zone encapsulates the processor, socket, and the entire
thermal/mechanical enabling solution.
thermal/mechanical enabling solution.
2.5.4.2
Assembly Drawing
Figure 2-16. Exploded View of CEK Thermal Solution Components