IBM Quad-Core Intel Xeon E5405 44R5630 User Manual
Product codes
44R5630
Quad-Core Intel® Xeon® Processor 5400 Series TMDG
45
Thermal/Mechanical Reference Design
Note:
Intel has also developed an 1U alternative reference heatsink design. This
alternative heatsink design meets the thermal profile specifications of the
Quad-Core Intel® Xeon® Processor E5400 Series
and offers the advantages of
weight reduction and cost savings. Refer to
for detail information.
2.5.7
Components Overview
2.5.7.1
Heatsink with Captive Screws and Standoffs
The CEK reference heatsink uses snapped-fin technology for its design. It consists of a
copper base and copper fins with Shin-Etsu* G751 thermal grease as the TIM. The
mounting screws and standoffs are also made captive to the heatsink base for ease of
handling and assembly as shown in
copper base and copper fins with Shin-Etsu* G751 thermal grease as the TIM. The
mounting screws and standoffs are also made captive to the heatsink base for ease of
handling and assembly as shown in
heatsinks, respectively.
Figure 2-21. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5400
Series Thermal Profile
35
40
45
50
55
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
Tcas
e
(
C
)
T
CASE_MAX
@ TDP
1U CEK Reference Solution
Y = 0.246 * X + 40
Thermal Profile
Y = 0.298 * X + 43.2
60
65