IBM Quad-Core Intel Xeon E5405 44R5630 User Manual
Product codes
44R5630
Quad-Core Intel® Xeon® Processor 5400 Series TMDG
9
Introduction
1
Introduction
1.1
Objective
The purpose of this guide is to describe the reference thermal solution and design
parameters required for the Quad-Core Intel® Xeon® Processor 5400 Series.
parameters required for the Quad-Core Intel® Xeon® Processor 5400 Series.
It is also the intent of this document to comprehend and demonstrate the processor
cooling solution features and requirements. Furthermore, this document provides an
understanding of the processor thermal characteristics, and discusses guidelines for
meeting the thermal requirements imposed over the entire life of the processor. The
thermal/mechanical solutions described in this document are intended to aid
component and system designers in the development and evaluation of processor
compatible thermal/mechanical solutions.
cooling solution features and requirements. Furthermore, this document provides an
understanding of the processor thermal characteristics, and discusses guidelines for
meeting the thermal requirements imposed over the entire life of the processor. The
thermal/mechanical solutions described in this document are intended to aid
component and system designers in the development and evaluation of processor
compatible thermal/mechanical solutions.
1.2
Scope
The thermal/mechanical solutions described in this document pertain to a solution(s)
intended for use with the Quad-Core Intel® Xeon® Processor 5400 Series in 1U, 2U,
2U+ and workstation form factors systems. This document contains the mechanical
and thermal requirements of the processor cooling solution. In case of conflict, the data
in the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet supersedes any data
in this document. Additional information is provided as a reference in the appendices.
intended for use with the Quad-Core Intel® Xeon® Processor 5400 Series in 1U, 2U,
2U+ and workstation form factors systems. This document contains the mechanical
and thermal requirements of the processor cooling solution. In case of conflict, the data
in the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet supersedes any data
in this document. Additional information is provided as a reference in the appendices.
1.3
References
Material and concepts available in the following documents may be beneficial when
reading this document.
reading this document.
Table 1-1.
Reference Documents (Sheet 1 of 2)
Document
Comment
European Blue Angel Recycling Standards
http://www.blauer-engel.de
Intel
®
Xeon
®
Dual- and Multi- Processor Family Thermal Test Vehicle
User's Guide
See Note at bottom table.
LGA771 Socket Mechanical Design Guide
See Note following table.
LGA771 SMT Socket Design Guidelines
See Note following table.
LGA771 Daisy Chain Test Vehicle User Guide
See Note following table.
Stoakley Platform Design Guide (PDG)
See Note following table.
Dual-Core Intel
®
Xeon
®
Processor-Based Servers Platform Design
Guide (PDG)
See Note following table.
Dual-Core Intel
®
Xeon
®
Processor-Based Workstation Platform Design
Guide (PDG)
See Note following table.
Clovertown, Harpertown & Wolfdale-DP Processors Compatibility Design
Guide for Bensley, Bensley-VS, and Glidewell Platforms
See Note following table.
PECI Feature Set Overview
See Note following table
Platform Environment Control Interface(PECI) Specification
See Note following table
Quad-Core Intel® Xeon® Processor 5400 Series Datasheet
See Note following table.
Clovertown_Harpertown_Wolfdale-DP Processor Enabled CEK and
Package Mechanical Models (in IGES and ProE* format)
Available electronically