STMicroelectronics M24C64-WMN6TP Memory IC M24C64-WMN6TP Data Sheet



DocID16891 Rev 28

Stressing the device outside the ratings listed in 

 may cause permanent damage to 

the device. These are stress ratings only, and operation of the device at these, or any other 
conditions outside those indicated in the operating sections of this specification, is not 
implied. Exposure to absolute maximum rating conditions for extended periods may affect 
device reliability.

          

Ambient operating temperature

–40

130

°C

T

STG

Storage temperature

–65

150

°C

T

LEAD

Lead temperature during soldering

see note

(1)

1. Compliant with JEDEC Std J-STD-020D (for small body, Sn-Pb or Pb-free assembly), the ST ECOPACK® 

7191395 specification, and the European directive on Restrictions of Hazardous Substances (RoHS) 

2011/65/EU.

°C

PDIP-specific lead temperature during soldering

-

260

(2)

2. T

LEAD

 max must not be applied for more than 10 s.

°C

I

OL

DC output current (SDA = 0)

-

5

mA

V

IO

Input or output range

–0.50

6.5

V

V

CC

Supply voltage

–0.50

6.5

V

V

ESD

Electrostatic pulse (Human Body model)

(3)

3. Positive and negative pulses applied on different combinations of pin connections, according to AEC-

Q100-002 (compliant with JEDEC Std JESD22-A114, C1=100 pF, R1=1500 

).

-

4000

V