Microchip Technology IC MCU OTP 2KX PIC17C42A-16/P DIP-40 MCP PIC17C42A-16/P Data Sheet

 



 

 1996 Microchip Technology Inc.

DS30412C-page 177

Applicable Devices 42 R42 42A 43 R43 44

Standard Operating Conditions (unless otherwise stated)
Operating temperature

-40˚C

≤

 T

A

 

≤

 +85˚C for industrial and 

0˚C 

≤

 T

A

 

≤

 +70˚C for commercial

D001

V

DD

Supply Voltage

4.5

–

6.0

V

D002

V

DR

RAM Data Retention
Voltage (Note 1)

1.5 * 

–

–

V

Device in SLEEP mode

D003

V

POR

V

DD

 start voltage to

ensure internal 
Power-on Reset signal

–

V

SS

–

V

See section on Power-on Reset for 
details

D004

S

VDD

V

DD

 rise rate to 

ensure internal
Power-on Reset signal

0.060 *

–

–

mV/ms See section on Power-on Reset for 

details

D010
D011
D012
D013
D015
D014

I

DD

Supply Current 
(Note 2)

–
–
–
–
–
–

3
6

11
19
25
95

6

12 *
24 *

38
50

150

mA
mA
mA
mA
mA

µ

A

F

OSC

 = 4 MHz  (Note 4)

F

OSC

 = 8 MHz

F

OSC

 = 16 MHz

F

OSC

 = 25 MHz

F

OSC

 = 33 MHz

F

OSC

 = 32 kHz, 

WDT enabled (EC osc configuration)

D020
D021

I

PD

Power-down 
Current (Note 3)

–
–

10

< 1

40

5

µ

A

µ

A

V

DD

 = 5.5V, WDT enabled

V

DD

 = 5.5V, WDT disabled

*

These parameters are characterized but not tested.

†

Data in "Typ" column is at 5V, 25˚C unless otherwise stated.  These parameters are for design guidance only 
and are not tested.

Note 1: This is the limit to which V

DD

 can be lowered in SLEEP mode without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin 

loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an 
impact on the current consumption.
The test conditions for all I

DD

 measurements in active operation mode are: 

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to V

DD

 or V

SS

, T0CKI = V

DD

, 

MCLR = V

DD

; WDT enabled/disabled as specified. 

Current consumed from the oscillator and I/O’s driving external capacitive or resistive loads needs to be con-
sidered.
For the RC oscillator, the current through the external pull-up resistor (R) can be estimated as: V

DD

 / (2 

•

 R). 

For capacitive loads, the current can be estimated (for an individual I/O pin) as (C

L

 

•

 V

DD

) 

•

 f

C

L

 = Total capacitive load on the I/O pin; f = average frequency the I/O pin switches. 

The capacitive currents are most significant when the device is configured for external execution (includes 
extended microcontroller mode).

3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-

sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V

DD

 and V

SS

. 

4: For RC osc configuration, current through Rext is not included.  The current through the resistor can be esti-

mated by the formula  I

R

 = V

DD

/2Rext  (mA) with Rext  in kOhm.