Intel Celeron Processors 540 BX80537540 Data Sheet
Product codes
BX80537540
Intel
®
Celeron
®
M Processor Datasheet
29
Package Mechanical Specifications and Pin Information
4
Package Mechanical
Specifications and Pin Information
Specifications and Pin Information
The processor is available in 478-pin Micro-FCPGA and 479 ball Micro-FCBGA packages.
Different views of the Micro-FCPGA package are shown in
dimensions are shown in
. Different views of the Micro-FCBGA package are shown in
through
. Package dimensions are shown in
. The Intel
Celeron M
processor die offset is illustrated in
The Micro-FCBGA may have capacitors placed in the area surrounding the die. Because the die-
side capacitors are electrically conductive, and only slightly shorter than the die height, care should
be taken to avoid contacting the capacitors with electrically conductive materials. Doing so may
short the capacitors, and possibly damage the device or render it inactive. The use of an insulating
material between the capacitors and any thermal solution should be considered to prevent capacitor
shorting.
Figure 4. Micro-FCPGA Package Top and Bottom Isometric Views
NOTE: All dimensions in millimeters. Values shown for reference only. Refer to
for details.
TOP VIEW
BOTTOM VIEW
LABEL
PACKAGE KEEPOUT
DIE
CAPACITOR AREA