Intel Celeron Processors 540 BX80537540 Data Sheet

Product codes
BX80537540
Page of 69
Intel
®
 Celeron
®
 M Processor Datasheet
65
Thermal Specifications and Design Considerations
5.1
Thermal Specifications
5.1.1
Thermal Diode
The Intel
 
Celeron M processor incorporates two methods of monitoring die temperature, the Intel 
Thermal Monitor and the thermal diode. The Intel Thermal Monitor (detailed in 
) must 
be used to determine when the maximum specified processor junction temperature has been 
reached. The second method, the thermal diode, can be read by an off-die analog/digital converter 
(a thermal sensor) located on the motherboard, or a standalone measurement kit. The thermal diode 
may be used to monitor the die temperature of the processor for thermal management or 
instrumentation purposes but cannot be used to indicate that the maximum T
J
 of the processor has 
been reached. Please see 
 for thermal diode usage recommendation when the 
PROCHOT# signal is not asserted.
 provide the diode interface and specifications.
Note:
The reading of the external thermal sensor (on the motherboard) connected to the processor 
thermal diode signals, will not necessarily reflect the temperature of the hottest location on the die. 
This is due to inaccuracies in the external thermal sensor, on-die temperature gradients between the 
location of the thermal diode and the hottest location on the die, and time based variations in the die 
temperature measurement. Time based variations can occur when the sampling rate of the thermal 
diode (by the thermal sensor) is slower than the rate at which the T
J
 temperature can change. 
The offset between the thermal diode based temperature reading and the Intel Thermal Monitor 
reading may be characterized using the Intel Thermal Monitor’s automatic mode activation of 
thermal control circuit. This temperature offset must be taken into account when using the 
processor thermal diode to implement power management events.
Table 27.  Thermal Diode Interface
Table 28.  Thermal Diode Specifications
NOTES:
1. Intel does not support or recommend operation of the thermal diode under reverse bias. Intel does not 
support or recommend operation of the thermal diode when the processor power supplies are not within their 
specified tolerance range.
2. Characterized at 100 °C.
3. Not 100% tested. Specified by design/characterization.
4. The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode 
equation: 
Signal Name
Pin/Ball Number
Signal Description
THERMDA
B18
Thermal diode anode
THERMDC
A18
Thermal diode cathode
Symbol
Parameter
Min
Typ
Max
Unit
Notes
I
FW
Forward Bias Current
5
300
µA
1
n
Diode Ideality Factor
1.00151
1.00220
1.00289
2, 3, 4
R
T
Series Resistance
3.06
ohms
2, 3, 5