STMicroelectronics M24C64-WBN6P Memory IC M24C64-WBN6P Data Sheet
Product codes
M24C64-WBN6P
DocID16891 Rev 28
M24C64-W M24C64-R M24C64-F
41
9
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com
.
ECOPACK
®
is an ST trademark.
Figure 16. TSSOP8 – 8-lead thin shrink small outline, package outline
1. Drawing is not to scale.
Table 18. TSSOP8 – 8-lead thin shrink small outline, package mechanical data
Symbol
millimeters
inches
(1)
1. Values in inches are converted from mm and rounded to four decimal digits.
Typ.
Min.
Max.
Typ.
Min.
Max.
A
–
–
1.200
–
–
0.0472
A1
–
0.050
0.150
–
0.0020
0.0059
A2
1.000
0.800
1.050
0.0394
0.0315
0.0413
b
–
0.190
0.300
–
0.0075
0.0118
c
–
0.090
0.200
–
0.0035
0.0079
CP
–
–
0.100
–
–
0.0039
D
3.000
2.900
3.100
0.1181
0.1142
0.1220
e
0.650
–
–
0.0256
–
–
E
6.400
6.200
6.600
0.2520
0.2441
0.2598
E1
4.400
4.300
4.500
0.1732
0.1693
0.1772
L
0.600
0.450
0.750
0.0236
0.0177
0.0295
L1
1.000
–
–
0.0394
–
–
–
0°
8°
–
0°
8°