Microchip Technology Microstick for the 3V PIC24F K-series DM240013-1 DM240013-1 Data Sheet
Product codes
DM240013-1
PIC24F16KL402 FAMILY
DS31037B-page 200
2011 Microchip Technology Inc.
26.1
DC Characteristics
FIGURE 26-1:
PIC24F16KL402 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
TABLE 26-1:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
Operating Junction Temperature Range
T
J
-40
—
+125
°C
Operating Ambient Temperature Range
T
A
-40
—
+85
°C
Power Dissipation:
Internal Chip Power Dissipation:
Internal Chip Power Dissipation:
P
INT
= V
DD
x (I
DD
–
I
OH
)
P
D
P
INT
+ P
I
/
O
W
I/O Pin Power Dissipation:
P
I
/
O
=
({V
DD
– V
OH
} x I
OH
) +
(V
OL
x I
OL
)
Maximum Allowed Power Dissipation
P
DMAX
(T
J
– T
A
)/
JA
W
Frequency
Vo
lt
a
g
e
(
V
DD
)
1.80V
32 MHz
3.60V
3.00V
3.60V
8 MHz
3.00V
Note:
For frequencies between 8 MHz and 32 MHz, F
MAX
= 20 MHz * (V
DD
– 1.8) + 8 MHz.
TABLE 26-2:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol
Typ
Max
Unit
Notes
Package Thermal Resistance, 20-Pin SPDIP
JA
62.4
—
°C/W
Package Thermal Resistance, 28-Pin SPDIP
JA
60
—
°C/W
Package Thermal Resistance, 20-Pin SSOP
JA
108
—
°C/W
Package Thermal Resistance, 28-Pin SSOP
JA
71
—
°C/W
Package Thermal Resistance, 20-Pin SOIC
JA
75
—
°C/W
Package Thermal Resistance, 28-Pin SOIC
JA
80.2
—
°C/W
Package Thermal Resistance, 20-Pin QFN
JA
43
—
°C/W
Package Thermal Resistance, 28-Pin QFN
JA
32
—
°C/W
Package Thermal Resistance, 14-Pin SPDIP
JA
62.4
—
°C/W
Package Thermal Resistance, 14-Pin TSSOP
JA
108
—
°C/W
Note 1:
Junction to ambient thermal resistance, Theta-
JA
(
JA
) numbers are achieved by package simulations.