Microchip Technology DM182015-1 User Manual
PIC18 Wireless Development Board Schematic
© 2011-2012 Microchip Technology Inc.
Preliminary
DS70654B-page 36
A.3
PIC18 WIRELESS DEVELOPMENT BOARD PCB LAYOUT
The PIC18 Wireless Development Board is a two-layer, FR4, 0.062 inch, plated
through-hole PCB construction.
through-hole PCB construction.
through
illustrates the PCB
layout of the PIC18 Wireless Development Board.
FIGURE A-4:
PIC18 WIRELESS DEVELOPMENT BOARD TOP
SILK-SCREEN
SILK-SCREEN
FIGURE A-5:
PIC18 WIRELESS DEVELOPMENT BOARD TOP COPPER