Microchip Technology SC70EV User Manual

SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide

DS51874A-page 22

2.4.8

The PCB as a SC70, SOT-23 to DIP Socket Converter

There may be occasions when it is desirable to convert the footprint of the device to
that of a DIP package. This allows the device to be installed into an existing DIP socket.
Two 1x4 row pins need to be installed into the PCB’s DIP footprint (on the bottom) when
the device is installed into the appropriate package footprint.
This allows the PCB to convert the SC70 and SOT-23 footprints to a 300-mil DIP-8 foot-
print.

TABLE 2-4:

SUPPORTED DIGITAL POTENTIOMETERS

Device

SC70

SOT-23

DIP

Comment

MCP4012

—

Yes

—

SOT-23-6, uses Up/Down interface

MCP4013

—

Yes

—

SOT-23-6, uses Up/Down interface

MCP4014

—

Yes

—

SOT-23-5, uses Up/Down interface

MCP4017

Yes

—

MCP40D17

Yes

—

MCP4018

Yes

—

MCP40D18

Yes

—

MCP4019

Yes

—

MCP40D19

Yes

—

MCP4022

—

Yes

—

SOT-23-6, uses Up/Down interface

MCP4023

—

Yes

—

SOT-23-6, uses Up/Down interface

MCP4024

—

Yes

—

SOT-23-5, uses Up/Down interface

MCP4131

—

Yes

Has multiplexed SDI/SDO

MCP4132

—

Yes

MCP4141

—

Yes

Has multiplexed SDI/SDO

MCP4142

—

Yes

MCP4151

—

Yes

Has multiplexed SDI/SDO

MCP4152

—

Yes

MCP4161

—

Yes

Has multiplexed SDI/SDO

MCP4162

—

Yes

MCP41010

—

Yes

MCP41050

—

Yes

MCP41100

—

Yes