Microchip Technology SC70EV User Manual
SC70-6 AND SOT-23-6/8 TO DIP-8
EVALUATION BOARD USER’S GUIDE
© 2009 Microchip Technology Inc.
DS51874A-page 9
Chapter 1. Product Overview
1.1
INTRODUCTION
This chapter provides an overview of the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation
Board and covers the following topics:
• What is the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board?
• What the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board kit includes
Board and covers the following topics:
• What is the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board?
• What the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board kit includes
1.2
WHAT IS THE SC70-6 AND SOT-23-6/8 TO DIP-8 EVALUATION BOARD?
The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board allows the system designer to
quickly evaluate the operation of Microchip Technology’s devices in any of the following
packages:
• SC70-6
• SC70-5
• SC70-3
• SOT-23-8
• SOT-23-6
• SOT-23-5
• SOT-23-3
• DIP-8
The board has a 6-pin header (PICkit Serial, ICSP, etc.) that can be easily jumpered to
the device’s desired pins to communicate with the device (using PICkit Serial) or in the
case of PIC microcontrollers or EEPROM, programmed (using ICSP).
Figure 1-1 shows the top view of the PCB. The board allows the devices to easily be
jumpered into a desired circuit. Also, the SC70 and SOT-23 packages could be
converted to a DIP footprint. Each pad has a passive component footprint that is
connected to the VDD plane (RxU) and a second passive component footprint that is
connected to the VSS plane (RxD).
quickly evaluate the operation of Microchip Technology’s devices in any of the following
packages:
• SC70-6
• SC70-5
• SC70-3
• SOT-23-8
• SOT-23-6
• SOT-23-5
• SOT-23-3
• DIP-8
The board has a 6-pin header (PICkit Serial, ICSP, etc.) that can be easily jumpered to
the device’s desired pins to communicate with the device (using PICkit Serial) or in the
case of PIC microcontrollers or EEPROM, programmed (using ICSP).
Figure 1-1 shows the top view of the PCB. The board allows the devices to easily be
jumpered into a desired circuit. Also, the SC70 and SOT-23 packages could be
converted to a DIP footprint. Each pad has a passive component footprint that is
connected to the VDD plane (RxU) and a second passive component footprint that is
connected to the VSS plane (RxD).
FIGURE 1-1:
PCB Top View.