Microchip Technology MCP6XXXEV-AMP4 User Manual

DS51681A-page 14

© 2007 Microchip Technology Inc.

There are two options available when using single op amps in SOIC-8 packages 
(150 mil wide):
• Soldering onto the MCP6XXX Amplifier Evaluation Board 4, or 
• Soldering it onto a separate board which is connected to the DIP-8 socket

Figure 2-10 shows a SOIC-8 op amp soldered onto the MCP6XXX Amplifier Evaluation 
Board 4.

Figure 2-11 shows a SOIC-8 op amp and a DIP-8 socket, soldered onto the 8-Pin 
SOIC/MSOP/TSSOP/DIP Evaluation Board available from Microchip Technology Inc. 
(order # SOIC8EV). The two interconnect strips on the bottom are Samtec part # 
BBS-14-T-B or equivalent and are soldered into the through holes for the DIP-8 socket. 
Figure 2-12 shows this board plugged into the MCP6XXX Amplifier Evaluation Board 
4.

Note: The DIP-8 socket must be empty; only one op amp can be used at a time.

Solder an SOIC-8
Op Amp onto the
board

Note: Insert the interconnect strips into the DIP-8 socket on the MCP6XXX Ampli-

fier Evaluation Board 4. Place the SOIC8EV board on the top of the inter-
connect strips with the same pin orientation. Now solder the strips to the top 
board; this procedure ensures correct alignment of the strips. Clip the pins 
flush with the top surface of the SOIC8EV board, then solder the SOIC-8 
op amp on the top.