Microchip Technology ADM00421 User Manual
MCP2210 EVALUATION KIT
USER’S GUIDE
© 2012 Microchip Technology Inc.
DS52057A-page 33
Appendix B. Bill of Materials
TABLE B-1:
BILL OF MATERIALS - MCP2210 BREAKOUT BOARD
Qty
Reference
Description_
Manufacturer
Part Number
1
C1
Cap. Cer. 22 uF 10V 20% Y5V 1206
TDK
®
Corporation
C3216Y5V1A226Z
3
C2, C4, C5
Cap. Cer. 1 uF 10% 16V X7R 0603
AVX Corporation
0603YC104KAT2A
1
C3
Cap. Cer. 4.7 uF 6.3V 10% X5R 0603
TDK Corporation
C1608X5R0J475K
1
C6
Cap. Cer. 1 uF 16V 10% X7R 0603
TDK Corporation
C1608X7R1C105K
2
J1, J2
DO NOT POPULATE
Conn. Hdr. Male .100 1x7 POS Vert.
Conn. Hdr. Male .100 1x7 POS Vert.
TE Connectivity Ltd.
HDR M 1x7 Vertical
1
J3
DO NOT POPULATE
Conn. Hdr. Male .100 1x6 POS Vert.
Conn. Hdr. Male .100 1x6 POS Vert.
TE Connectivity Ltd.
HDR M 1x6 Vertical
1
J4
DO NOT POPULATE
Conn. Hdr. Male .100 1x3 POS Vert.
Conn. Hdr. Male .100 1x3 POS Vert.
TE Connectivity Ltd.
HDR M 1x3 Vertical
1
J5
Conn. Rcpt. USB Mini B R/A SMD
Hirose Electric Co. Ltd.
UX60SC-MB-5ST(80)
1
PCB
RoHS compliant bare PCB, MCP2210
Breakout Board
Breakout Board
—
104-00419
1
R1
Res. 390 Ohm 1/10W 5% 0603 SMD
Panasonic
®
- ECG
ERJ-3GEYJ391V
1
U1
IC USB-TO-SPI SSOP-20
Microchip Technology
Inc.
Inc.
MCP2210-I/SS
1
U2
IC LDO Reg. 500 mA 3.3V SOT-223-3
Microchip Technology
Inc.
Inc.
MCP1825S-3302E/DB
1
X1
Cer. Resonator 12.0 MHz SMD
Murata Electronics
®
CSTCE12M0G55-R0
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
used in manufacturing uses all RoHS-compliant components.
TABLE B-2:
BILL OF MATERIALS - MCP2210 SPI SLAVE MOTHERBOARD
Qty
Reference
Description_
Manufacturer
Part Number
5
C1, C2, C3,
C4, C6
C4, C6
Cap. Cer. 0.1 uF 50V X7R 10% 0603
TDK Corporation
C1608X7R1H104K
2
C5, C7
Cap. Cer. 4.7 uF 6.3V 10% X5R 0603
TDK Corporation
C1608X5R0J475K
19
J1, J2, J3, J4,
J5, J6, J7, J8,
J9, J14, J15,
J16, J17, J18,
J19, J20, J21,
J22, J23
J5, J6, J7, J8,
J9, J14, J15,
J16, J17, J18,
J19, J20, J21,
J22, J23
PC test point Tin SMD
Harwin Plc.
S1751-46R
1
J10
Conn. Hdr. Male .100 1x6 Pos. RA
TE Connectivity Ltd.
HDR M 1x6 RA
2
J11, J13
Conn. Hdr. Male .100 1x7 Pos. Vert.
TE Connectivity Ltd.
HDR M 1x7 Vertical
1
J12
Conn. Hdr. Male .100 2x8 Pos. Vert.
TE Connectivity Ltd.
HDR M 2x8 Vertical
1
L1
Ferrite Chip 47 Ohms 500 mA 0603
Laird Technologies
®
LI0603E470R-10
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
used in manufacturing uses all RoHS-compliant components.