Microchip Technology MCP1630DM-DDBS1 Data Sheet
MCP1630/MCP1630V
DS21896C-page 18
2004-2013 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
D
A
A1
L
c
(F)
α
A2
E1
E
p
B
n
1
2
φ
β
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
.037 REF
F
Footprint (Reference)
exceed .010" (0.254mm) per side.
Notes:
Drawing No. C04-111
*Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Foot Angle
Lead Width
Lead Thickness
β
α
c
B
φ
.003
.009
.006
.012
Dimension Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
Foot Length
Standoff
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016
.024
.118 BSC
.118 BSC
.000
.030
.193 TYP.
.033
MIN
p
n
Units
.026 BSC
NOM
8
INCHES
0.95 REF
-
-
.009
.016
0.08
0.22
0°
0.23
0.40
8°
MILLIMETERS*
0.65 BSC
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
.043
.031
.037
.006
0.40
0.00
0.75
MIN
MAX
NOM
1.10
0.80
0.15
0.95
MAX
8
-
-
-
15°
5°
-
15°
5°
-
JEDEC Equivalent: MO-187
0°
-
8°
5°
5°
-
-
15°
15°
-
-
-
-
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
at http://www.microchip.com/packaging