Microchip Technology MA240017 Data Sheet
2008-2011 Microchip Technology Inc.
DS39927C-page 217
PIC24F16KA102 FAMILY
TABLE 29-1:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
Operating Junction Temperature Range
T
J
-40
—
+175
°C
Operating Ambient Temperature Range
T
A
-40
—
+125
°C
Power Dissipation:
Internal Chip Power Dissipation:
Internal Chip Power Dissipation:
P
INT
= V
DD
x (I
DD
–
I
OH
)
P
D
P
INT
+ P
I
/
O
W
I/O Pin Power Dissipation:
P
I
/
O
=
({V
DD
– V
OH
} x I
OH
) +
(V
OL
x I
OL
)
Maximum Allowed Power Dissipation
P
DMAX
(T
J
– T
A
)/
JA
W
TABLE 29-2:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol
Typ
Max
Unit
Notes
Package Thermal Resistance, 20-Pin PDIP
JA
62.4
—
°C/W
Package Thermal Resistance, 28-Pin SPDIP
JA
60
—
°C/W
Package Thermal Resistance, 20-Pin SSOP
JA
108
—
°C/W
Package Thermal Resistance, 28-Pin SSOP
JA
71
—
°C/W
Package Thermal Resistance, 20-Pin SOIC
JA
75
—
°C/W
Package Thermal Resistance, 28-Pin SOIC
JA
80.2
—
°C/W
Package Thermal Resistance, 20-Pin QFN
JA
43
—
°C/W
Package Thermal Resistance, 28-Pin QFN
JA
32
—
°C/W
Note 1:
Junction to ambient thermal resistance, Theta-
JA
(
JA
) numbers are achieved by package simulations.