Microchip Technology AC164337 Data Sheet
dsPIC30F1010/202X
DS70000178D-page 272
2006-2014 Microchip Technology Inc.
44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body (QFN)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
Units
Dimension Limits
N
e
A
A1
A3
A3
E
E2
D
D2
b
L
L
K
0.80
0.00
0.00
6.30
6.30
0.25
0.30
0.20
0.25
0.30
0.20
44
0.65 BSC
0.90
0.02
0.02
0.20 REF
8.00 BSC
8.00 BSC
6.45
8.00 BSC
6.45
0.30
0.40
0.30
0.40
—
1.00
0.05
0.05
6.80
6.80
0.38
0.50
0.38
0.50
—
MIN
NOM
MAX
MILLIMETERS
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Package is saw singulated
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing No. C04–103, Sept. 8, 2006
A3
A1
A
TOP VIEW
BOTTOM VIEW
N
N
NOTE 1
1
1
2
2
E
E2
D
K
L
b
e
EXPOSED
PAD
D2