Microchip Technology MA330031-2 Data Sheet

Page of 530
 2011-2013 Microchip Technology Inc.
DS70000657H-page 479
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X AND PIC24EPXXXGP/MC20X
33.0
PACKAGING INFORMATION
33.1
Package Marking Information          
Legend:
XX...X
Customer-specific information
Y
Year code (last digit of calendar year)
YY
Year code (last 2 digits of calendar year)
WW
Week code (week of January 1 is week ‘01’)
NNN
Alphanumeric traceability code
  
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (     )
can be found on the outer packaging for this package.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
28-Lead SPDIP
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
Example
dsPIC33EP64GP
1310017
502-I/SP
3
e
28-Lead SOIC (.300”)
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
Example
dsPIC33EP64GP
1310017
502-I/SO
3
e
28-Lead SSOP
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
dsPIC33EP64
GP502-I/SS
1310017
3
e
XXXXXXXX
28-Lead QFN-S (6x6x0.9 mm)
XXXXXXXX
YYWWNNN
33EP64GP
Example
502-I/MM
1310017