Microchip Technology AC244045 Data Sheet
2006-2012 Microchip Technology Inc.
DS51292U-page 71
Debug Header Target Footprints
INTRODUCTION
To connect a debug header directly to a target board (without the use of a transition
socket) the following information will be helpful.
socket) the following information will be helpful.
DIP DEVICE FOOTPRINTS
DIP device adapter footprints shown will accept adapter plugs like Samtec series APA
plugs. These plugs can be soldered in place during development/emulation and
eliminate the need for any other sockets.
plugs. These plugs can be soldered in place during development/emulation and
eliminate the need for any other sockets.
FIGURE 1:
DIP FOOTPRINT
TQFP/PLCC DEVICE FOOTPRINTS
TQFP/PLCC device adapter footprints shown will accept board stackers like Samtec
series DWM 0.050 Pitch Stackers. These stackers can be soldered in place during
development/emulation and eliminate the need for any other sockets.
series DWM 0.050 Pitch Stackers. These stackers can be soldered in place during
development/emulation and eliminate the need for any other sockets.
FIGURE 2:
SINGLE-ROW TQFP/PLCC FOOTPRINT
0.100
C
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
DIMENSIONS ARE IN INCHES.
Drawing of DIP is 40-pin.
DIP
C
8-Pin
0.300
14-Pin
0.300
18-Pin
0.300
20-Pin
0.300
28-Pin
0.300
40-Pin
0.600
0.028 DIA
PLATED-THRU
HOLES
PLATED-THRU
HOLES
0.050
0.800
0.800
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
DIMENSIONS ARE IN INCHES.
Drawing of device is 44-pin TQFP/PLCC.
0.028 DIA
PLATED-THRU
HOLES
PLATED-THRU
HOLES