Microchip Technology DM240015 Data Sheet
PIC24FJ128GC010 FAMILY
DS30009312B-page 426
2012-2013 Microchip Technology Inc.
37.1
DC Characteristics
FIGURE 37-1:
PIC24FJ128GC010 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
TABLE 37-1:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
PIC24FJ128GC010 Family:
Operating Junction Temperature Range
Operating Junction Temperature Range
T
J
-40
—
+100
°C
Operating Ambient Temperature Range
T
A
-40
—
+85
°C
Power Dissipation:
Internal Chip Power Dissipation: P
Internal Chip Power Dissipation: P
INT
= V
DD
x (I
DD
–
I
OH
)
P
D
P
INT
+ P
I
/
O
W
I/O Pin Power Dissipation:
P
I
/
O
=
({V
DD
– V
OH
} x I
OH
) +
(V
OL
x I
OL
)
Maximum Allowed Power Dissipation
P
DMAX
(T
JMAX
– T
A
)/
JA
W
Frequency
Vo
lt
a
g
e
(
V
DD
)
(Note 1)
32 MHz
3.6V
3.6V
(Note 1)
Note 1:
Lower recommended operating boundary is 2.0V or V
BOR
(when BOR is enabled). For best
analog performance, operation above 2.2V is suggested, but not required.
PIC24FJXXXGC0XX
TABLE 37-2:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol
Typ
Max
Unit
Note
Package Thermal Resistance, 12x12x1 mm 100-pin TQFP
JA
45.0
—
°C/W
(Note
Package Thermal Resistance, 10x10x1 mm 64-pin TQFP
JA
48.3
—
°C/W
(Note
Package Thermal Resistance, 9x9x0.9 mm 64-pin QFN
JA
28.0
—
°C/W
(Note
Package Thermal Resistance, 10x10x1.1 mm 121-pin BGA
JA
40.2
—
°C/W
(Note
Note 1:
Junction to ambient thermal resistance, Theta-
JA
(
JA
) numbers are achieved by package simulations.