Microchip Technology MA330020 Data Sheet

Page of 398
 2008-2014 Microchip Technology Inc.
DS70000318G-page 351
dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04
28.0
PACKAGING INFORMATION
28.1
Package Marking Information 
Legend: XX...X
Customer-specific information
Y
Year code (last digit of calendar year)
YY
Year code (last 2 digits of calendar year)
WW
Week code (week of January 1 is week ‘01’)
NNN
Alphanumeric traceability code
 
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (      )
can be found on the outer packaging for this package.
Note:
If the full Microchip part number cannot be marked on one line, it is carried over to the next
line, thus limiting the number of available characters for customer-specific information.
3
e
3
e
28-Lead SPDIP
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
Example
dsPIC33FJ06GS
0830235
28-Lead SOIC
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
Example
dsPIC33FJ06GS
0830235
202-E/SP
202-E/SO
3
e
3
e
18-Lead SOIC (.300”)
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
dsPIC33FJ06
0830235
GS101-I/SO
3
e
28-Lead QFN-S
XXXXXXXX
XXXXXXXX
YYWWNNN
Example
33FJ06GS
202EMM
0830235
3
e