Microchip Technology ADM00419 User Manual
MCP2210 BREAKOUT MODULE
USER’S GUIDE
© 2012 Microchip Technology Inc.
DS52056A-page 3
Table of Contents
2.1 Introduction ................................................................................................... 11
2.2 Board Setup ................................................................................................. 11
2.3 Board Operation ........................................................................................... 12
2.4 MCP2210 Typical Usage Scenarios ............................................................. 14
2.2 Board Setup ................................................................................................. 11
2.3 Board Operation ........................................................................................... 12
2.4 MCP2210 Typical Usage Scenarios ............................................................. 14
A.1 Introduction .................................................................................................. 17
A.2 Board – Schematic ....................................................................................... 18
A.3 Board – Top Silk and Pads .......................................................................... 19
A.4 Board – Top Silk, Pads and Copper ............................................................ 20
A.5 Board – Top Pads and Copper .................................................................... 21
A.6 Board – Bottom Silk and Pads ..................................................................... 22
A.7 Board – Bottom Silk, Pads and Copper ....................................................... 23
A.8 Board – Bottom Pads and Copper ............................................................... 24
A.2 Board – Schematic ....................................................................................... 18
A.3 Board – Top Silk and Pads .......................................................................... 19
A.4 Board – Top Silk, Pads and Copper ............................................................ 20
A.5 Board – Top Pads and Copper .................................................................... 21
A.6 Board – Bottom Silk and Pads ..................................................................... 22
A.7 Board – Bottom Silk, Pads and Copper ....................................................... 23
A.8 Board – Bottom Pads and Copper ............................................................... 24