Microchip Technology MA330027 Data Sheet

Page of 622
dsPIC33EPXXX(GP/MC/MU)806/810/814 and PIC24EPXXX(GP/GU)810/814
DS70616G-page 504
 2009-2012 Microchip Technology Inc.
TABLE 32-7:
DC CHARACTERISTICS: POWER-DOWN CURRENT (I
PD
)  
DC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
-40°C 
  T
A
 
  +85°C for Industrial
-40°C 
  T
A
 
  +125°C for Extended
Param.
Typ.
(
)
Max.
Units
Conditions
Power-Down Current (I
PD
)
DC60d
50
100
A
-40°C
3.3V
Base Power-Down Current
)
DC60a
60
200
A
+25°C
DC60b
250
500
A
+85°C
DC60c
1600
3000
A
+125°C
DC61d
8
10
A
-40°C
3.3V
Watchdog Timer Current: 
I
WDT(
DC61a
10
15
A
+25°C
DC61b
12
20
A
+85°C
DC61c
13
25
A
+125°C
Note 1: I
PD
 (Sleep) current is measured as follows:
• CPU core is off, oscillator is configured in EC mode and external clock is active, OSC1 is driven with 
external square wave from rail-to-rail (EC Clock Overshoot/Undershoot < 250 mV required)
• CLKO is configured as an I/O input pin in the Configuration Word
• External Secondary Oscillator (SOSC) is disabled (i.e., SOSCO and SOSCI pins are configured as 
digital I/O inputs)
• All I/O pins are configured as inputs and pulled to V
SS
• MCLR = V
DD
, WDT and FSCM are disabled, all peripheral modules are disabled (PMDx bits are 
all ones)
• The VREGS bit (RCON<8>) = 0 (i.e., core regulator is set to stand-by while the device is in Sleep 
mode)
• RTCC is disabled
• The VREGSF bit (RCON<11>) = 0 (i.e., Flash regulator is set to stand-by while the device is in 
Sleep mode)
• JTAG is disabled
2: Data in the “Typ” column is at 3.3V, +25ºC unless otherwise stated.
3: The Watchdog Timer current is the additional current consumed when the WDT module is enabled. This 
current should be added to the base I
PD
 current.
4: These currents are measured on the device containing the most memory in this family.