Microchip Technology MA330027 Data Sheet
2009-2012 Microchip Technology Inc.
DS70616G-page 523
dsPIC33EPXXX(GP/MC/MU)806/810/814 and PIC24EPXXX(GP/GU)810/814
FIGURE 32-11:
HIGH-SPEED PWMx MODULE FAULT TIMING CHARACTERISTICS
(dsPIC33EPXXX(MC/MU)806/810/814 DEVICES ONLY)
(dsPIC33EPXXX(MC/MU)806/810/814 DEVICES ONLY)
FIGURE 32-12:
HIGH-SPEED PWMx MODULE TIMING CHARACTERISTICS
(dsPIC33EPXXX(MC/MU)806/810/814 DEVICES ONLY)
(dsPIC33EPXXX(MC/MU)806/810/814 DEVICES ONLY)
TABLE 32-30: HIGH-SPEED PWMx MODULE TIMING REQUIREMENTS
(dsPIC33EPXXX(MC/MU)806/810/814 DEVICES ONLY)
AC CHARACTERISTICS
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
(unless otherwise stated)
Operating temperature
-40°C
T
A
+85°C for Industrial
-40°C
T
A
+125°C for Extended
Param.
Symbol
Characteristic
Min.
Typ.
Max.
Units
Conditions
MP10
T
FPWM
PWM Output Fall Time
—
—
—
ns
See Parameter
MP11
T
RPWM
PWM Output Rise Time
—
—
—
ns
See Parameter
MP20
T
FD
Fault Input
to PWM
I/O Change
—
—
15
ns
MP30
T
FH
Fault Input Pulse Width
15
—
—
ns
Note 1: These parameters are characterized but not tested in manufacturing.
Fault Input
PWMx
MP30
MP20
(active-low)
PWMx
MP11
MP10
for load conditions.