Microchip Technology TSSOP20EV Data Sheet
© 2009 Microchip Technology Inc.
DS22233A-page 3
MCP434X/436X
1.0
ELECTRICAL
CHARACTERISTICS
CHARACTERISTICS
Absolute Maximum Ratings †
Voltage on V
DD
with respect to V
SS
................ -0.6V to +7.0V
Voltage on CS, SCK, SDI, SDI/SDO, WP, and
RESET with respect to V
RESET with respect to V
SS
...................................
-0.6V to 12.5V
Voltage on all other pins (PxA, PxW, PxB, and
SDO) with respect to V
SDO) with respect to V
SS
............................
-0.3V to V
DD
+ 0.3V
Input clamp current, I
IK
(V
I
< 0, V
I
> V
DD
, V
I
> V
PP
ON
HV pins) ......................±20 mA
Output clamp current, I
OK
(V
O
< 0 or V
O
> V
DD
) ..................................................±20 mA
Maximum output current sunk by any Output pin
......................................................................................25 mA
Maximum output current sourced by any Output pin
......................................................................................25 mA
Maximum current out of V
SS
pin .................................100 mA
Maximum current into V
DD
pin ....................................100 mA
Maximum current into P
X
A, P
X
W & P
X
B pins ............±2.5 mA
Storage temperature ....................................-65°C to +150°C
Ambient temperature with power applied
.....................................................................-40°C to +125°C
Package power dissipation (T
Ambient temperature with power applied
.....................................................................-40°C to +125°C
Package power dissipation (T
A
= +50°C, T
J
= +150°C)
TSSOP-14................................................................1000 mW
TSSOP-20................................................................ 1110 mW
QFN-20 (4x4) ...........................................................2320 mW
Soldering temperature of leads (10 seconds) ............. +300°C
ESD protection on all pins
TSSOP-20................................................................ 1110 mW
QFN-20 (4x4) ...........................................................2320 mW
Soldering temperature of leads (10 seconds) ............. +300°C
ESD protection on all pins
................................... ≥ 4 kV (HBM),
..........................................................................
≥ 300V (MM)
Maximum Junction Temperature (T
J
) ......................... +150°C
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.