Microchip Technology AC244045 Data Sheet
PIC16F72X/PIC16LF72X
DS41341E-page 220
© 2009 Microchip Technology Inc.
23.5
Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C
Operating temperature -40°C
≤ T
A
≤ +125°C
Param
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
θ
JA
Thermal Resistance Junction to Ambient
60
°C/W
28-pin SPDIP package
80
°C/W
28-pin SOIC package
90
°C/W
28-pin SSOP package
27.5
°C/W
28-pin UQFN 4x4mm package
27.5
°C/W
28-pin QFN 6x6mm package
47.2
°C/W
40-pin PDIP package
46
°C/W
44-pin TQFP package
24.4
°C/W
44-pin QFN 8x8mm package
TH02
θ
JC
Thermal Resistance Junction to Case
31.4
°C/W
28-pin SPDIP package
24
°C/W
28-pin SOIC package
24
°C/W
28-pin SSOP package
24
°C/W
28-pin UQFN 4x4mm package
24
°C/W
28-pin QFN 6x6mm package
24.7
°C/W
40-pin PDIP package
14.5
°C/W
44-pin TQFP package
20
°C/W
44-pin QFN 8x8mm package
TH03
T
JMAX
Maximum Junction Temperature
150
°C
TH04
PD
Power Dissipation
—
W
PD = P
INTERNAL
+ P
I
/
O
TH05
P
INTERNAL
Internal Power Dissipation
—
W
P
INTERNAL
= I
DD
x V
DD
(1)
TH06
P
I
/
O
I/O Power Dissipation
—
W
P
I
/
O
=
Σ (I
OL
* V
OL
) +
Σ (I
OH
* (V
DD
- V
OH
))
TH07
P
DER
Derated Power
—
W
P
DER
= PD
MAX
(T
J
- T
A
)/
θ
JA
(2)
Note 1: I
DD
is current to run the chip alone without driving any load on the output pins.
2: T
A
= Ambient Temperature
3: T
J
= Junction Temperature