Microchip Technology AC244045 Data Sheet

© 2009 Microchip Technology Inc.

DS41341E-page 225

Standard Operating Conditions (unless otherwise stated)
Operating Temperature 

-40°C 

≤ T

A

 

≤ +125°C

OS08

HF

OSC

Internal Calibrated HFINTOSC 
Frequency

±2%

—

16.0

—

MHz

0°C 

≤ T

A

 

≤ +85°C, 

V

DD

 

≥ 2.5V

±5%

—

16.0

—

MHz

-40°C 

≤ T

A

 

≤ +125°C

OS08A MF

OSC

Internal Calibrated MFINTOSC 
Frequency

±2%

—

500

—

kHz

0°C 

≤ T

A

 

≤ +85°C

V

DD

 

≥ 2.5V

±5%

—

500

10

kHz

-40°C 

≤ T

A

 

≤ +125°C

OS10*

T

IOSC

 

ST

HFINTOSC Wake-up from Sleep 
Start-up Time

—

—

5

8

μs

MFINTOSC Wake-up from Sleep 

Start-up Time

—

—

20

30

μs

*

These parameters are characterized but not tested.

†

Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are 
not tested.

Note 1: Instruction cycle period (T

CY

) equals four times the input oscillator time base period. All specified values are based on 

characterization data for that particular oscillator type under standard operating conditions with the device executing 
code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current 
consumption. All devices are tested to operate at “min” values with an external clock applied to the OSC1 pin. When an 
external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.

2: To ensure these oscillator frequency tolerances, V

DD

 and V

SS

 must be capacitively decoupled as close to the device as 

possible. 0.1

μF and 0.01 μF values in parallel are recommended.

3: By design.

F

OSC

CLKOUT

I/O pin
(Input)

I/O pin
(Output)

Q4

Q1

Q2

Q3

OS11

OS19

OS13

OS15

OS18, OS19

OS20

OS21

OS17

OS16

OS14

OS12

OS18

Old Value

New Value

Write

Fetch

Read

Execute

Cycle