Microchip Technology AC244045 Data Sheet

Page of 302
© 2009 Microchip Technology Inc.
DS41341E-page 301
PIC16F72X/PIC16LF72X
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
.
PART NO.
X
/XX
XXX
Pattern
Package
Temperature
Range
Device
   
Device:
PIC16F722, PIC16LF722, PIC16F722T, PIC16LF722T
(1)
PIC16F723, PIC16LF723, PIC16F723T, PIC16LF723T
(1)
PIC16F724, PIC16LF724, PIC16F724T, PIC16LF724T
(1)
PIC16F726, PIC16LF726, PIC16F726T, PIC16LF726T
(1)
PIC16F727, PIC16LF727, PIC16F727T, PIC16LF727T
(1)
Temperature 
Range:
I
=  
-40
°C to +85°C
E
=  
-40
°C to +125°C
MV
=  Micro Lead Frame (UQFN)
Package:
ML
=
Micro Lead Frame (QFN)
P
=
Plastic DIP
PT
=
TQFP (Thin Quad Flatpack)
SO
=
SOIC
SP
=
Skinny Plastic DIP
SS
=
SSOP
Pattern:
3-Digit Pattern Code for QTP (blank otherwise)
Examples:
a)
PIC16F722-E/SP 301 = Extended Temp.,
skinny PDIP package, QTP pattern #301
b)
PIC16F722-I/SO = Industrial Temp., SOIC
package
Note 1:
T
= In tape and reel.