Microchip Technology DM163025-1 Data Sheet
2012 Microchip Technology Inc.
DS30684A-page 459
PIC18(L)F2X/45K50
29.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
(†)
Ambient temperature under bias...............................................................................................................-40°C to +85°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to V
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to V
SS
(except V
DD
, V
USB
3V3
, D+, D- and MCLR) ....................... -0.3V to (V
DD
+ 0.3V)
Voltage on V
DD
with respect to V
SS
PIC18LF2X/45K50.................................................................................................... -0.3V to +4.5V
PIC18F2X/45K50...................................................................................................... -0.3V to +6.5V
PIC18F2X/45K50...................................................................................................... -0.3V to +6.5V
Voltage on V
USB
3V3
pin with respect to V
SS
...........................................................................................-0.3V to +4.0V
(3)
Voltage on D+ and D- pins with respect to V
SS
........................................................................ -0.3V to (V
USB
3V3
+ 0.3V)
Voltage on MCLR with respect to V
SS
(Note 2) ............................................................................................0V to +11.0V
Total power dissipation (Note 1) ...............................................................................................................................1.0W
Maximum current out of V
Maximum current out of V
SS
pin (-40°C to +85°C) .............................................................................................. 300 mA
Maximum current into V
DD
pin (-40°C to +85°C) ................................................................................................ 200 mA
Input clamp current, I
IK
(V
I
< 0 or V
I
> V
DD
)
20 mA
Output clamp current, I
OK
(V
O
< 0 or V
O
> V
DD
)
20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by
all ports (-40°C to +85°C)........................................................................................... 200 mA
Maximum current sourced by all ports (-40°C to +85°C) ......................................................................................185 mA
Note 1:
Power dissipation is calculated as follows:
Pdis = V
Pdis = V
DD
x {I
DD
–
I
OH
} +
{(V
DD
– V
OH
) x I
OH
} +
(V
OL
x I
OL
)
2:
Voltage spikes below V
SS
at the MCLR/V
PP
/RE3 pin, inducing currents greater than 80 mA, may cause
latch-up. Thus, a series resistor of 50-100
should be used when applying a “low” level to the MCLR/V
PP
/
RE3 pin, rather than pulling this pin directly to V
SS
.
3:
V
USB
3V3
must always be
V
DD
+ 0.3V. V
USB
3V3
must also be maintained
V
DD
- 0.3V on PIC18LF2X/45K50
devices.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.