Microchip Technology DM163025-1 Data Sheet

Page of 536
 2012 Microchip Technology Inc.
DS30684A-page 501
PIC18(L)F2X/45K50
31.0
PACKAGING INFORMATION
31.1
Package Marking Information          
Legend:
XX...X
Customer-specific information or Microchip part number
Y
Year code (last digit of calendar year)
YY
Year code (last 2 digits of calendar year)
WW
Week code (week of January 1 is week ‘01’)
NNN
Alphanumeric traceability code
  
Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator (     )
can be found on the outer packaging for this package.
Note
:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
28-Lead SPDIP (.300”)
Example
PIC18F25K50
0810017
3
e
28-Lead SOIC (7.50 mm)
Example
YYWWNNN
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
PIC18F25K50
3
e
28-Lead SSOP (5.30 mm)
Example
PIC18F25K50
0810017
3
e
-I/SS
-I/SP
-I/SO
0810017