Microchip Technology TSSOP20EV Data Sheet

DS51875A-page 12

© 2009 Microchip Technology Inc.

The 20-Pin TSSOP and SSOP Evaluation Board is a blank PCB that allows the user to 
configure the circuit to the exact requirements. The passive components use the 
surface-mount 805 package layout.

This evaluation board supports the following Microchip device families:

• Digital Potentiometers (Digi-Pots)

• CAN

• IrDA

• Serial Peripherals

• Switching Regulators

• PICmicro

®

 Microcontrollers

Figure 2-1 shows the evaluation board circuit. The pins on the 20-pin devices are tied 
together pin n to pin n. Pad Pn is tied to pin n of the TSSOP device. The SSOP package 
is on the bottom, so the pad Bn is tied to pin n of the SSOP device. The footprints for 
the pull-up (RxU) and pull-down (RxD) devices are labeled in relation to the TSSOP 
package, pin 1 is connected to R1U and R1D (which is connected to pin 20 of the 
SSOP device on the bottom of the board).

This circuit allows each pin to individually have any of the following: a pull-up resistor, 
a pull-down resistor (or a loading/filtering capacitor). Power supply filtering capacitors 
are connected between the VDD and VSS pads (C1 and C2).

The circuit has a 6-pin header that can be used for PICkit Serial communication as well 
as PIC ICSP. The signals of this header would need to be jumpered to the appropriate 
device signal.