Microchip Technology TDGL002 - chipKIT Uno32 Development Board TDGL002 TDGL002 Data Sheet

© 2011 Microchip Technology Inc.

DS61143H-page 159

Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature

-40°C 

≤ T

A

 

≤ +85°C for Industrial 

-40°C 

≤ T

A

 

≤ +105°C for V-Temp

D130

E

P

Cell Endurance

1000

—

—

E/W

—

D131

V

PR

V

DD

 for Read

V

MIN

—

3.6

V

—

D132

V

PEW

V

DD

 for Erase or Write

3.0

—

3.6

V

—

D134

T

RETD

Characteristic Retention

20

—

—

Year

—

D135

I

DDP

Supply Current during 
Programming

—

10

—

mA

—

T

WW

Word Write Cycle Time

20

—

40

μs

—

D136

T

RW

Row Write Cycle Time

(128 words per row)

3

4.5

—

ms

—

D137

T

PE

Page Erase Cycle Time

20

—

—

ms

—

T

CE

Chip Erase Cycle Time

80

—

—

ms

—

D138

LVDstartup Flash LVD Delay

—

—

6

μs

—

Data in “Typical” column is at 3.3V, 25°C unless otherwise stated.

The minimum SYSCLK for row programming is 4 MHz. Care should be taken to minimize bus activities 
during row programming, such as suspending any memory-to-memory DMA operations. If heavy bus 
loads are expected, selecting Bus Matrix Arbitration mode 2 (rotating priority) may be necessary. The 
default Arbitration mode is mode 1 (CPU has lowest priority).

Refer to the “PIC32MX Flash Programming Specification” (DS61145) for operating conditions during 
programming and erase cycles.

Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature

-40°C 

≤ T

A

 

≤ +85°C for Industrial

-40°C 

≤ T

A

 

≤ +105°C for V-Temp

0 Wait State

0 to 30

MHz

—

1 Wait State

31 to 60

2 Wait States

61 to 80

40 MHz maximum for PIC32MX320F032H and PIC32MX420F032H devices.