Microchip Technology TDGL002 - chipKIT Uno32 Development Board TDGL002 TDGL002 Data Sheet
Product codes
TDGL002
© 2011 Microchip Technology Inc.
DS61143H-page 213
PIC32MX3XX/4XX
Product Identification System
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
.
Architecture
MX = 32-bit RISC MCU core
Product Groups
3XX = General purpose microcontroller family
4XX = USB
Flash Memory Family
F
= Flash program memory
Program Memory Size
32 = 32K
64 = 64K
128 = 128K
256 = 256K
512 = 512K
64 = 64K
128 = 128K
256 = 256K
512 = 512K
Speed
40 = 40 MHz
80 = 80 MHz
80 = 80 MHz
Pin Count
H
= 64-pin
L
= 100-pin
Temperature Range
I
= -40
° C to +85° C (Industrial)
V
= -40
° C to +105° C (V-Temp)
Package
PT = 64-Lead (10x10x1 mm) TQFP (Thin Quad Flatpack)
PT = 100-Lead (12x12x1 mm) TQFP (Thin Quad Flatpack)
MR = 64-Lead (9x9x0.9 mm) QFN (Plastic Quad Flat)
BG = 121-Lead (10x10x1.1 mm) XBGA (Plastic Thin Profile Ball Grid Array)
PT = 100-Lead (12x12x1 mm) TQFP (Thin Quad Flatpack)
MR = 64-Lead (9x9x0.9 mm) QFN (Plastic Quad Flat)
BG = 121-Lead (10x10x1.1 mm) XBGA (Plastic Thin Profile Ball Grid Array)
Pattern
Three-digit QTP, SQTP, Code or Special Requirements (blank otherwise)
ES = Engineering Sample
ES = Engineering Sample
Examples:
PIC32MX320F032H-40I/PT:
General purpose PIC32MX,
32 KB program memory,
64-pin, Industrial temperature,
TQFP package.
General purpose PIC32MX,
32 KB program memory,
64-pin, Industrial temperature,
TQFP package.
PIC32MX360F256L-80I/PT:
General purpose PIC32MX,
256 KB program memory,
100-pin, Industrial temperature,
TQFP package.
General purpose PIC32MX,
256 KB program memory,
100-pin, Industrial temperature,
TQFP package.
Microchip Brand
Architecture
Flash Memory Family
Pin Count
Product Groups
Program Memory Size (KB)
PIC32 MX 3XX F 512 H T - 80 I / PT - XXX
Flash Memory Family
Speed
Pattern
Package
Temperature Range
Tape and Reel Flag (if applicable)