Microchip Technology MA330016 Data Sheet
© 2007-2011 Microchip Technology Inc.
DS70290J-page 13
dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304
2.0
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
2.1
Basic Connection Requirements
Getting started with the dsPIC33FJ32GP202/204 and
dsPIC33FJ16GP304 family of 16-bit Digital Signal
Controllers (DSCs) requires attention to a minimal set
of device pin connections before proceeding with
development. The following is a list of pin names, which
must always be connected:
• All V
dsPIC33FJ16GP304 family of 16-bit Digital Signal
Controllers (DSCs) requires attention to a minimal set
of device pin connections before proceeding with
development. The following is a list of pin names, which
must always be connected:
• All V
DD
and V
SS
pins
(see
• All AV
DD
and AV
SS
pins (even if ADC module is not
used)
(see
(see
• V
CAP
(see
)
• MCLR pin
(see
• PGECx/PGEDx pins used for In-Circuit Serial
Programming™ (ICSP™) and debugging purposes
(see
(see
)
• OSC1 and OSC2 pins when external oscillator
source is used
(see
(see
)
Additionally, the following pins may be required:
• V
• V
REF
+/V
REF
- pins used when external voltage
reference for ADC module is implemented
2.2
Decoupling Capacitors
The use of decoupling capacitors on every pair of
power supply pins, such as V
power supply pins, such as V
DD
, V
SS
, AV
DD
and
AV
SS
is required.
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
capacitors:
• Value and type of capacitor: Recommendation
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
• Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
• Handling high frequency noise: If the board is
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
• Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
Note 1: This data sheet summarizes the features
of the dsPIC33FJ32GP202/204 and
dsPIC33FJ16GP304 family of devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F/PIC24H Family Reference
Manual”. Please see the Microchip web
site (
dsPIC33FJ16GP304 family of devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F/PIC24H Family Reference
Manual”. Please see the Microchip web
site (
www.microchip.com
) for the latest
dsPIC33F/PIC24H Family Reference
Manual sections.
Manual sections.
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
available on all devices. Refer to
in
this data sheet for device-specific register
and bit information.
and bit information.
Note:
The AV
DD
and AV
SS
pins must be
connected independent of the ADC
voltage reference source.
voltage reference source.