Microchip Technology MA330016 Data Sheet

Page of 300
© 2007-2011 Microchip Technology Inc.
DS70290J-page 13
dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304
2.0
GUIDELINES FOR GETTING 
STARTED WITH 16-BIT 
DIGITAL SIGNAL 
CONTROLLERS
2.1
Basic Connection Requirements
Getting started with the dsPIC33FJ32GP202/204 and
dsPIC33FJ16GP304 family of 16-bit Digital Signal
Controllers (DSCs) requires attention to a minimal set
of device pin connections before proceeding with
development. The following is a list of pin names, which
must always be connected:
• All V
DD
 and V
SS
 pins 
(see 
• All AV
DD
 and AV
SS
 pins (even if ADC module is not 
used) 
(see 
• V
CAP
 
(see 
• MCLR pin 
(see 
• PGECx/PGEDx pins used for In-Circuit Serial 
Programming™ (ICSP™) and debugging purposes 
(see 
)
• OSC1 and OSC2 pins when external oscillator 
source is used 
(see 
)
Additionally, the following pins may be required:
• V
REF
+/V
REF
- pins used when external voltage 
reference for ADC module is implemented
2.2
Decoupling Capacitors
The use of decoupling capacitors on every pair of
power supply pins, such as V
DD
, V
SS
, AV
DD
 and
AV
SS
 is required. 
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation 
of 0.1 µF (100 nF), 10-20V. This capacitor should 
be a low-ESR and have resonance frequency in 
the range of 20 MHz and higher. It is 
recommended that ceramic capacitors be used.
• Placement on the printed circuit board: The 
decoupling capacitors should be placed as close 
to the pins as possible. It is recommended to 
place the capacitors on the same side of the 
board as the device. If space is constricted, the 
capacitor can be placed on another layer on the 
PCB using a via; however, ensure that the trace 
length from the pin to the capacitor is within 
one-quarter inch (6 mm) in length.
• Handling high frequency noise: If the board is 
experiencing high frequency noise, upward of 
tens of MHz, add a second ceramic-type capacitor 
in parallel to the above described decoupling 
capacitor. The value of the second capacitor can 
be in the range of 0.01 µF to 0.001 µF. Place this 
second capacitor next to the primary decoupling 
capacitor. In high-speed circuit designs, consider 
implementing a decade pair of capacitances as 
close to the power and ground pins as possible. 
For example, 0.1 µF in parallel with 0.001 µF.
• Maximizing performance: On the board layout 
from the power supply circuit, run the power and 
return traces to the decoupling capacitors first, 
and then to the device pins. This ensures that the 
decoupling capacitors are first in the power chain. 
Equally important is to keep the trace length 
between the capacitor and the power pins to a 
minimum thereby reducing PCB track inductance.
Note 1: This data sheet summarizes the features
of the dsPIC33FJ32GP202/204 and
dsPIC33FJ16GP304 family of devices. It
is not intended to be a comprehensive
reference source. To complement the
information in this data sheet, refer to the
“dsPIC33F/PIC24H Family Reference
Manual”
. Please see the Microchip web
site (
www.microchip.com
) for the latest
dsPIC33F/PIC24H Family Reference
Manual sections.
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
 in
this data sheet for device-specific register
and bit information.
Note:
The AV
DD
 and AV
SS
 pins must be
connected independent of the ADC
voltage reference source.