Microchip Technology MA330016 Data Sheet
dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304
DS70290J-page 210
© 2007-2011 Microchip Technology Inc.
22.1
DC Characteristics
TABLE 22-1:
OPERATING MIPS VS. VOLTAGE
Characteristic
V
DD
Range
(in Volts)
Temp Range
(in °C)
Max MIPS
dsPIC33FJ32GP202/204 and
dsPIC33FJ16GP304
—
V
BOR
-3.6V
(1)
-40°C to +85°C
40
—
V
BOR
-3.6V
(1)
-40°C to +125°C
40
Note 1: Device is functional at V
BORMIN
< V
DD
< V
DDMIN
. Analog modules such as the ADC will have degraded
performance. Device functionality is tested but not characterized. Refer to parameter
for the minimum and maximum BOR values.
TABLE 22-2:
THERMAL OPERATING CONDITIONS
Rating
Symbol
Min
Typ
Max
Unit
Industrial Temperature Devices
Operating Junction Temperature Range
T
J
-40
—
+125
°C
Operating Ambient Temperature Range
T
A
-40
—
+85
°C
Extended Temperature Devices
Operating Junction Temperature Range
T
J
-40
—
+155
°C
Operating Ambient Temperature Range
T
A
-40
—
+125
°C
Power Dissipation:
Internal chip power dissipation:
Internal chip power dissipation:
P
INT
= V
DD
x (I
DD
-
Σ I
OH
)
P
D
P
INT
+ P
I
/
O
W
I/O Pin Power Dissipation:
I/O =
Σ ({V
DD
- V
OH
} x I
OH
) +
Σ (V
OL
x I
OL
)
Maximum Allowed Power Dissipation
P
DMAX
(T
J
- T
A
)/
θ
JA
W
TABLE 22-3:
THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol
Typ
Max
Unit
Notes
Package Thermal Resistance, 44-pin QFN
θ
JA
32
—
°C/W
1
Package Thermal Resistance, 44-pin TFQP
θ
JA
45
—
°C/W
1
Package Thermal Resistance, 28-pin SPDIP
θ
JA
45
—
°C/W
1
Package Thermal Resistance, 28-pin SOIC
θ
JA
50
—
°C/W
1
Package Thermal Resistance, 28-pin SSOP
θ
JA
71
—
°C/W
1
Package Thermal Resistance, 28-pin QFN-S
θ
JA
35
—
°C/W
1
Note 1: Junction to ambient thermal resistance, Theta-
JA
(
θ
JA
) numbers are achieved by package simulations.