Microchip Technology MA330016 Data Sheet

© 2007-2011 Microchip Technology Inc.

DS70290J-page 269

Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

For the most current package drawings, please see the Microchip Packaging Specification located at 

http://www.microchip.com/packaging

Units

INCHES

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

28

Pitch

e

.100 BSC

Top to Seating Plane

A

–

–

.200

Molded Package Thickness

A2

.120

.135

.150

Base to Seating Plane

A1

.015

–

–

Shoulder to Shoulder Width

E

.290

.310

.335

Molded Package Width

E1

.240

.285

.295

Overall Length

D

1.345

1.365

1.400

Tip to Seating Plane

L

.110

.130

.150

Lead Thickness

c

.008

.010

.015

Upper Lead Width

b1

.040

.050

.070

Lower Lead Width

b

.014

.018

.022

Overall Row Spacing  §

eB

–

–

.430

NOTE 1

N

1 2

D

E1

eB

c

E

L

A2

e

b

b1

A1

A

3

Microchip Technology Drawing C04-070B