Microchip Technology DM164130-7 Data Sheet
PIC16(L)F1946/47
DS41414D-page 402
2010-2012 Microchip Technology Inc.
30.6
Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C
Operating temperature -40°C
T
A
+125°C
Param
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
JA
Thermal Resistance Junction to Ambient
48.3
C/W
64-pin TQFP package
28
C/W
64-pin QFN package
TH02
JC
Thermal Resistance Junction to Case
26.1
C/W
64-pin TQFP package
0.24
C/W
64-pin QFN package
TH03
T
JMAX
Maximum Junction Temperature
150
C
TH04
PD
Power Dissipation
—
W
PD = P
INTERNAL
+ P
I
/
O
TH05
P
INTERNAL
Internal Power Dissipation
—
W
P
INTERNAL
= I
DD
x V
DD(1)
TH06
P
I
/
O
I/O Power Dissipation
—
W
P
I
/
O
=
(I
OL
* V
OL
) +
(I
OH
* (V
DD
- V
OH
))
TH07
P
DER
Derated Power
—
W
P
DER
= PD
MAX
(T
J
- T
A
)/
JA(2),(3)
Note 1: I
DD
is current to run the chip alone without driving any load on the output pins.
2: T
A
= Ambient Temperature
3: T
J
= Junction Temperature