Microchip Technology AC164331 Data Sheet
PAGE
29
Cu
rre
n
t An
alo
g
/In
te
rf
ac
e
Fa
mil
y
Pr
oduc
ts
MCP
3
0
0
2
10
20
0
2
S
in
g
le
-e
nd
ed
SPI
2
.7 t
o
5.
5
65
0
±1
L
S
B
-4
0
to
+8
5
8-
Pin
PDI
P
, 8-
Pin
SOI
C
, 8
-Pi
n T
SSOP
M
C
P
3
0
0
4
1
0
2
0
0
4
S
in
gl
e-
e
n
d
e
d
S
P
I
2
.7 t
o
5.
5
5
5
0
±
1
LS
B
-40
t
o
+
8
5
1
4-
P
in
P
D
IP
, 14
-P
in
S
O
IC
, 14
-P
in
T
S
S
O
P
MCP
3
0
0
8
10
20
0
8
S
in
g
le
-e
nd
ed
SPI
2
.7 t
o
5.
5
55
0
±1
L
S
B
-4
0
to
+8
5
1
6
-Pi
n
PDIP
, 1
6
-P
in
SOI
C
M
C
P3
22
1
1
2
2
2
1
Si
ng
le
-e
n
d
e
d
I
2
C™
2
.7 t
o
5.
5
2
5
0
±
2
LS
B
-40
t
o
+
1
2
5
5
-P
in S
O
T
-23
A
MCP
3
2
0
1
12
10
0
1
S
in
g
le
-e
nd
ed
SPI
2
.7 t
o
5.
5
40
0
±1
L
S
B
-4
0
to
+8
5
8-
Pin
PDI
P
, 8-
Pin
SOI
C
, 8
-Pi
n T
SSOP
M
C
P
3
2
0
2
1
2
1
0
0
2
S
in
gl
e-
e
n
d
e
d
S
P
I
2
.7 t
o
5.
5
5
5
0
±
1
LS
B
-40
t
o
+
8
5
8
-P
in
P
D
IP
, 8
-P
in S
O
IC
, 8-
P
in
TS
S
O
P
MCP
3
2
0
4
12
10
0
4
S
in
g
le
-e
nd
ed
SPI
2
.7 t
o
5.
5
40
0
±1
L
S
B
-4
0
to
+8
5
1
4
-Pi
n
PDIP
, 1
4
-P
in
SOI
C
, 1
4
-P
in
T
S
SOP
M
C
P
3
2
0
8
1
2
1
0
0
8
S
in
gl
e-
e
n
d
e
d
S
P
I
2
.7 t
o
5.
5
4
0
0
±
1
LS
B
-40
t
o
+
8
5
1
6-
P
in
P
D
IP
, 16
-P
in
S
O
IC
MCP
3
3
0
1
13
10
0
1
D
if
fe
ren
ti
al
SPI
2
.7 t
o
5.
5
45
0
±1
L
S
B
-4
0
to
+8
5
8-
Pin
PDI
P
, 8-
Pin
SOI
C
, 8
-Pi
n M
S
O
P
M
C
P
3
3
0
2
1
3
1
0
0
2
D
if
fe
re
nt
ia
l
S
P
I
2
.7 t
o
5.
5
4
5
0
±
1
LS
B
-40
t
o
+
8
5
1
4-
P
in
P
D
IP
, 14
-P
in
S
O
IC
, 14
-P
in
T
S
S
O
P
MCP
3
3
0
4
13
10
0
4
D
if
fe
ren
ti
al
SPI
2
.7 t
o
5.
5
45
0
±1
L
S
B
-4
0
to
+8
5
1
6
-Pi
n
PDIP
, 1
6
-P
in
SOI
C
MIXED SIGNAL –
De
lt
a
-Sigm
a
A/D Co
nv
e
rte
rs
Pa
rt
#
Re
s
o
lu
tion
(b
it
s
)
Ma
x
imu
m
Sa
m
p
lin
g
Ra
te
(s
am
p
les
/s
ec
)
# of
I
n
p
u
t
Cha
n
n
e
ls
In
te
rf
a
c
e
Sup
p
ly
V
o
lt
ag
e R
a
ng
e
(V
)
T
y
p
ic
a
l Su
p
p
ly
C
u
rre
n
t
(
μ
A)
T
y
p
ic
a
l INL
(p
p
m
)
Te
m
p
. R
a
n
g
e
(°C
)
Fe
at
u
res
Pa
ck
ag
es
M
C
P
3
5
5
0
-5
0
2
2
1
3
1 D
if
f
S
PI
2.
7 t
o
5.
5
1
20
2
-40 t
o
+
1
25
5
0
H
z
r
e
je
ct
io
n
8
-P
in
S
O
IC
, 8
-Pi
n M
S
O
P
M
C
P3
55
0-
60
22
15
1
Dif
f
SP
I
2.
7 t
o
5.
5
14
0
2
-40 t
o
+
1
25
6
0
Hz
re
je
c
tio
n
8
-Pi
n
SOIC,
8
-P
in
MSOP
M
C
P
3
5
5
1
2
2
1
4
1
D
if
f
S
PI
2.
7 t
o
5.
5
1
20
2
-40 t
o
+
1
25
S
im
u
lt
an
eo
us 50
/6
0
H
z
r
e
je
ct
io
n
8
-P
in
S
O
IC
, 8
-Pi
n M
S
O
P
MCP
3
5
5
3
20
60
1
Dif
f
SP
I
2.
7 t
o
5.
5
14
0
2
-40 t
o
+
1
25
8
-Pi
n
SOIC,
8
-P
in
MSOP
TC
34
00
(1)
1
0
to
1
6
>4
0
0
1
Dif
f
2
-W
ir
e
1
.8
to
5
.5
2
6
0
3
8
0
t
o
+8
5
8
-Pi
n
PDIP
, 8
-Pi
n
SOIC
TC
34
01
(1)
10
t
o
1
6
>4
0
0
2
Dif
f
2-
W
ir
e
1.
8 t
o
5.
5
30
0
38
0 t
o
+
8
5
E
n
a
b
le
mo
d
e
, Re
s
e
t mo
n
ito
r,
P
o
we
r-fa
il
mo
n
ito
r
1
6
-P
in
PD
IP
, 1
6
-Pi
n
QSOP
TC
34
02
(1)
1
0
to
1
6
>4
0
0
4
Dif
f
2
-W
ir
e
1
.8
to
5
.5
2
5
0
3
8
0
t
o
+8
5
1
6
-Pin
PD
IP
, 1
6
-Pi
n
QSOP
TC
34
05
(1)
10
t
o
1
6
>4
0
0
3 S
in
g
le
-e
nd
ed
,
1
Dif
f
2-
W
ir
e
1.
8 t
o
5.
5
25
0
38
0 t
o
+
8
5
En
a
b
le
mo
d
e
, Re
s
e
t mo
n
ito
r
1
6
-P
in
PD
IP
, 1
6
-Pi
n
QSOP
N
O
T
E
1
:
Al
l TC
34
0X
ar
e
no
t r
e
co
m
m
e
n
d
e
d
f
o
r
ne
w
de
si
gns
.
M
IXED
SIG
N
A
L
–
Ener
g
y
M
eas
ur
em
ent I
C
s
Pa
rt
#
Dy
na
m
ic
M
eas
ur
em
e
n
t
Ty
p
ic
a
l
M
e
as
ur
e
m
en
t
Ac
c
u
ra
c
y
Ga
in
T
y
pi
c
a
l V
o
lt
ag
e
Re
fe
re
nc
e
D
rift
Ty
p
ic
a
l S
u
p
p
ly
C
u
rre
n
t
Su
ppl
y
V
o
lt
ag
e R
a
n
g
e
(
V
)
T
e
m
p
. R
a
n
g
e
(
°C
)
Fe
at
u
res
P
a
c
kag
e
s
M
C
P
3
9
0
5
5
0
0
:1
0.
1
%
1
, 2,
8,
16
15
p
p
m
AI
DD
- 2
mA
DI
DD
- 1
5
mA
4.
5
t
o
5
.5
-4
0
t
o
+
8
5
A
c
ti
v
e
(
rea
l)
po
w
e
r
pu
ls
e
ou
tp
ut
24
-P
in
SSO
P
MCP
3
9
0
6
10
00
:1
0.
1
%
1,
2,
16
, 3
2
15
p
p
m
AI
DD
- 2
mA
DI
DD
- 1
5
mA
4
.5 t
o
5.
5
-4
0
to
+8
5
Ac
ti
ve
(
rea
l)
po
w
e
r pu
ls
e ou
tp
ut
24
-P
in
SSOP
M
IXED SIG
NAL –
Succ
ess
ive
Approx
ima
tion
Re
gis
ter (SAR) A/D
C
o
nve
rt
e
rs (c
ontin
ued)
Pa
rt
#
Re
s
o
lu
tio
n
(b
it
s
)
Ma
x
im
u
m
Sa
m
p
li
n
g
R
a
te
(k
sa
m
p
le
s/
se
c)
# o
f
In
pu
t
Ch
a
n
ne
ls
In
p
u
t T
y
p
e
In
te
rfa
c
e
In
p
u
t V
o
lt
a
g
e
Ra
ng
e
(V
)
Ma
x
. S
u
p
p
ly
C
u
rre
n
t
(
μ
A)
Ma
x
. INL
Te
m
p
. R
a
n
g
e
(°C)
Pa
ck
ag
es