Microchip Technology MA160014 Data Sheet
2010-2012 Microchip Technology Inc.
DS41412F-page 15
PIC18(L)F2X/4XK22
TABLE 1-1:
DEVICE FEATURES
F
eatu
res
P
IC
18F
23K
22
P
IC
18LF
23K
22
PI
C
1
8
F
2
4
K2
2
P
IC
1
8LF
24K
22
PI
C
1
8
F
2
5
K2
2
P
IC
18L
F2
5K
22
P
IC
18F
26K
22
P
IC
1
8
L
F
2
6K
22
P
IC
18F
43K
22
P
IC
18LF
43K
22
P
IC
18F4
4
K
2
2
P
IC
1
8LF
44K
22
P
IC
1
8F45
K
2
2
P
IC
1
8
LF4
5K
22
P
IC
1
8
F
46K
22
P
IC
1
8
L
F
4
6K
22
P
ro
g
ram
Mem
o
ry (B
ytes)
8192
163
84
3276
8
6
5536
819
2
163
84
3276
8
65536
P
ro
g
ram
Mem
o
ry
(Instructi
on
s)
4096
8192
1638
4
3
2768
409
6
8192
1638
4
32768
D
a
ta
Me
mory (
B
yte
s
)
5
12
76
8
1
536
38
96
5
1
2
7
6
8
1
536
38
96
D
a
ta
E
E
P
R
OM
Memo
ry (B
ytes)
2
56
25
6
256
10
24
2
5
6
2
5
6
256
10
24
I/O P
o
rt
s
A
, B
, C, E
(1
)
A
, B
, C, E
(1
)
A
, B
, C, E
(1
)
A,
B,
C,
E
(1
)
A
,
B
, C, D, E
A
, B
, C, D, E
A
, B
, C, D, E
A
, B
, C
, D, E
C
a
pture
/C
o
mp
a
re/P
W
M Mo
d-
ul
es (C
C
P
)
2
2222
222
E
n
h
anced
C
C
P
M
odul
es
(E
C
C
P
)
- Ha
lf B
ri
d
g
e
2
2221
111
E
n
h
anced
C
C
P
M
odul
es
(E
C
C
P
)
- F
u
ll Br
id
g
e
1
1112
222
10-bi
t A
nal
og
-to-D
ig
ital
Mo
dul
e
(A
DC)
2
in
ternal
1
7
i
nput
2 i
n
te
rnal
17 i
n
p
u
t
2 i
n
ter
nal
17 i
npu
t
2 i
n
terna
l
17 i
nput
2
in
ternal
2
8
i
nput
2 i
n
te
rnal
28
in
put
2 i
n
ter
nal
28 i
n
p
u
t
2 i
n
tern
al
28 i
npu
t
P
a
cka
ges
28-p
in
P
D
IP
2
8
-pin S
OIC
2
8
-pi
n S
S
O
P
28-pi
n Q
F
N
2
8
-p
in
UQF
N
2
8
-pin P
D
IP
28
-pin S
OIC
2
8
-p
in
SSO
P
2
8
-pin QF
N
28-
pi
n U
Q
FN
28
-pin P
D
IP
28-
pi
n S
OIC
28
-pi
n
S
S
O
P
28
-pin QF
N
28-
pi
n P
D
IP
2
8
-pi
n S
O
IC
28-
pi
n S
S
OP
28-
pi
n QFN
4
0
-pi
n P
D
IP
4
0
-p
in
UQF
N
44-p
in QFN
44-
pi
n TQF
P
4
0
-pin P
D
IP
40-
pi
n U
Q
FN
4
4
-pin QF
N
4
4
-pi
n T
Q
FP
40
-pin P
D
IP
4
0
-pi
n U
Q
F
N
44
-pin QF
N
44-pi
n T
Q
FP
40-
pi
n P
D
IP
4
0
-p
in
UQF
N
44-
pi
n QFN
44
-p
in
TQ
F
P
Interr
upt S
ource
s
33
T
imers (
16-bi
t)
4
S
e
ri
al
C
o
m
m
u
ni
c
a
tion
s
2
M
SSP
,
2 E
U
S
A
R
T
S
R
La
tch
Ye
s
C
h
arge
T
ime M
easure
m
ent U
n
it
Modu
le
(C
TMU
)
Ye
s
P
ro
g
ram
m
abl
e
H
igh
/Low
-V
ol
tage
D
e
tect (H
L
V
D
)
Ye
s
P
ro
g
ram
m
abl
e B
ro
w
n-out R
e
s
e
t
(B
O
R
)
Ye
s
R
e
set
s
(
a
n
d
Delays)
P
O
R, BOR,
R
ESET
In
str
u
ction,
S
tack O
v
erfl
ow
,
S
tack U
nderfl
ow
(P
W
R
T
, OS
T
),
MC
LR
, W
D
T
Instr
u
ction S
e
t
75 Instr
u
cti
ons;
83 w
it
h E
x
tend
ed Instru
cti
o
n S
e
t enab
le
d
Opera
tin
g Fre
quen
cy
D
C
- 64
MH
z
No
te
1
:
P
O
R
T
E
c
ontai
ns
the
si
ng
le
R
E
3
rea
d
-o
nl
y
bi
t.