Freescale Semiconductor StarterTRAK USB for Automotive Applications TRK-USB-MPC5604B TRK-USB-MPC5604B TRK-USB-MPC5604B Data Sheet
Product codes
TRK-USB-MPC5604B
Package pinouts and signal descriptions
MPC5604B/C Microcontroller Data Sheet, Rev. 11.1
Freescale Semiconductor
49
•
HV—High voltage external power supply for voltage regulator module. This must be provided externally through
VDD_HV power pin.
VDD_HV power pin.
•
BV—High voltage external power supply for internal ballast module. This must be provided externally through
VDD_BV power pin. Voltage values should be aligned with V
VDD_BV power pin. Voltage values should be aligned with V
DD
.
•
LV—Low voltage internal power supply for core, FMPLL and flash digital logic. This is generated by the internal
voltage regulator but provided outside to connect stability capacitor. It is further split into four main domains to ensure
noise isolation between critical LV modules within the device:
— LV_COR—Low voltage supply for the core. It is also used to provide supply for FMPLL through double bonding.
— LV_CFLA—Low voltage supply for code flash module. It is supplied with dedicated ballast and shorted to
voltage regulator but provided outside to connect stability capacitor. It is further split into four main domains to ensure
noise isolation between critical LV modules within the device:
— LV_COR—Low voltage supply for the core. It is also used to provide supply for FMPLL through double bonding.
— LV_CFLA—Low voltage supply for code flash module. It is supplied with dedicated ballast and shorted to
LV_COR through double bonding.
— LV_DFLA—Low voltage supply for data flash module. It is supplied with dedicated ballast and shorted to
LV_COR through double bonding.
— LV_PLL—Low voltage supply for FMPLL. It is shorted to LV_COR through double bonding.
Figure 10. Voltage regulator capacitance connection
The internal voltage regulator requires external capacitance (C
REGn
) to be connected to the device in order to provide a stable
low voltage digital supply to the device. Capacitances should be placed on the board as near as possible to the associated pins.
Care should also be taken to limit the serial inductance of the board to less than 5 nH.
Care should also be taken to limit the serial inductance of the board to less than 5 nH.
Each decoupling capacitor must be placed between each of the three V
DD_LV
/V
SS_LV
supply pairs to ensure stable voltage (see
The internal voltage regulator requires a controlled slew rate of both V
DD_HV
and V
DD_BV
C
REG
1
(L
V_COR/L
V
_DFLA
)
DEVICE
VSS_LV
VDD_BV
VDD_LV
C
DE
C
1
(B
alla
st
decoup
ling)
VSS_LV
VDD_LV
VDD_HV
VSS_LV
VDD_LV
C
REG2
(LV_COR/LV_CFLA)
C
REG3
C
DEC2
DEVICE
VDD_BV
I
VDD_LVn
V
REF
VDD_HV
Voltage Regulator
VSS_HV
VSS_LVn
(supply/IO decoupling)
(LV_COR/LV_PLL)