Freescale Semiconductor KIT912F634EVME Evaluation Kit KIT912F634EVME KIT912F634EVME Data Sheet
Product codes
KIT912F634EVME
Freescale Semiconductor
Advanced Information
Advanced Information
© Freescale Semiconductor, Inc., 2010-2013. All rights reserved.. All rights reserved.
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
Document Number: MM912F634
Rev. 7.0, 5/2013
Integrated S12 Based Relay
Driver with LIN
The MM912F634 is an integrated single package solution that
integrates an HCS12 microcontroller with a SMARTMOS
analog control IC. The Die to Die Interface (D2D) controlled
analog die combines system base chip and application specific
functions, including a LIN transceiver.
Features
• 16-Bit S12 CPU, 32 kByte FLASH, 2.0 kByte RAM
• Background Debug (BDM) & Debug Module (DBG)
• Die to Die bus interface for transparent memory mapping
• On-chip oscillator & two independent watchdogs
• LIN 2.1 Physical Layer Interface with integrated SCI
• Six digital MCU GPIOs shared with SPI (PA5…0)
• 10-Bit, 15 Channel - Analog to Digital Converter (ADC)
• 16-Bit, 4 Channel - Timer Module (TIM16B4C)
• 8-Bit, 2 Channel - Pulse width modulation module (PWM)
• Six high voltage / Wake-up inputs (L5.0)
• Three low voltage GPIOs (PB2.0)
• Background Debug (BDM) & Debug Module (DBG)
• Die to Die bus interface for transparent memory mapping
• On-chip oscillator & two independent watchdogs
• LIN 2.1 Physical Layer Interface with integrated SCI
• Six digital MCU GPIOs shared with SPI (PA5…0)
• 10-Bit, 15 Channel - Analog to Digital Converter (ADC)
• 16-Bit, 4 Channel - Timer Module (TIM16B4C)
• 8-Bit, 2 Channel - Pulse width modulation module (PWM)
• Six high voltage / Wake-up inputs (L5.0)
• Three low voltage GPIOs (PB2.0)
• Low Power Modes with cyclic sense & forced wake-up
• Current Sense Module with selectable gain
• Reverse Battery protected Voltage Sense Module
• Two protected low side outputs to drive inductive loads
• Two protected high side outputs
• Chip temperature sensor
• Hall sensor supply
• Integrated voltage regulator(s)
• Current Sense Module with selectable gain
• Reverse Battery protected Voltage Sense Module
• Two protected low side outputs to drive inductive loads
• Two protected high side outputs
• Chip temperature sensor
• Hall sensor supply
• Integrated voltage regulator(s)
Figure 1. Simplified Application Diagram
MM912F634
48-PIN LQFP-EP, 7.0 mm x 7.0 mm
AE SUFFIX: Exposed Pad Option
AE SUFFIX: Exposed Pad Option
48-PIN LQFP, 7.0 mm x 7.0 mm
AP SUFFIX: Non-exposed Pad Option
AP SUFFIX: Non-exposed Pad Option
See Page 2.
ORDERING INFORMATION
M
PA0/MISO
RESET_A
RESET
VDD
EVDD
EVDD
EVSS
LIN
LS1
LS2
ISENSEH
1
VS1
Power Supply
LIN interface
5V digital I/O
LGND
ISENSEL
1
HSUP
Analog/Digital Inputs
(High Voltage- and Wake
Up capable)
Up capable)
DGND
L3
1
L1
L2
1
PTB1/AD1/TX/TIM0CH1
PTB2/AD2/PWM/TIM0CH2
Hall Sensor supply
5V GPI/O with optional
pull-up (shared with
ADC, PWM, Timer, SCI)
pull-up (shared with
ADC, PWM, Timer, SCI)
Low-Side Drivers
Current Sense Module
PTB0/AD0/RX/TIM0CH0
L0
PA1/MOSI
PA2/SCK
PA3/SS
PA4
PA2/SCK
PA3/SS
PA4
BKGD/MODC
EXTAL
XTAL
EXTAL
XTAL
VDDX
EVDDX
EVDDX
EVSSX
5V Supply
Reset
HS1
HS2
1
12V Light/LED
and switch supply
and switch supply
Debug and
external
Oscillator
VSENSE
1
TEST
L4
1
L5
1
VS2
TEST_A
TCLK
Hall Sensor
Hall Sensor
2.5V Supply
Digital Ground
ADC2p5
AGND
ADC Supply
PGND
MCU Test
Analog Test
Battery Sense
PA5
1)
Feature not available in all Analog Options
MM912F634