Intel E1400 BX80557E1400 Data Sheet

74

Datasheet

The case temperature is defined at the geometric top center of the processor. Analysis 

indicates that real applications are unlikely to cause the processor to consume 

maximum power dissipation for sustained time periods. Intel recommends that 

complete thermal solution designs target the Thermal Design Power (TDP) indicated in 

 instead of the maximum processor power consumption. The Thermal Monitor 

feature is designed to protect the processor in the unlikely event that an application 

exceeds the TDP recommendation for a sustained periods of time. For more details on 

. To ensure maximum flexibility for future 

requirements, systems should be designed to the 775_VR_CONFIG_06 guidelines, even 

if a processor with a lower thermal dissipation is currently planned. In all cases the 

1,2

1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power 

that the processor can dissipate.

2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the

maximum T

C

 will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for

the allowed combinations of power and T

C

.

3. Specification is at 35 °C T

C

 and typical voltage loadline. Specification is ensured by design characterization and not 100% tested.

4. 775_VR_CONFIG_06 guidelines provide a design target for meeting future thermal requirements.

E1200

1.6

65.0

8

775_VR_

CONFIG_06 

Guidance

5

,