IBM Intel Xeon L5420 44E5137 User Manual
Product codes
44E5137
Thermal/Mechanical Reference Design
14
Quad-Core Intel® Xeon® Processor 5400 Series TMDG
2.1.2
Quad-Core Intel® Xeon® Processor 5400 Series Package
The Quad-Core Intel® Xeon® Processor 5400 Series is packaged using the flip-chip
land grid array (FC-LGA) package technology. Please refer to the Quad-Core Intel®
Xeon® Processor 5400 Series Datasheet for detailed mechanical specifications. The
Quad-Core Intel® Xeon® Processor 5400 Series mechanical drawing shown in
land grid array (FC-LGA) package technology. Please refer to the Quad-Core Intel®
Xeon® Processor 5400 Series Datasheet for detailed mechanical specifications. The
Quad-Core Intel® Xeon® Processor 5400 Series mechanical drawing shown in
, and
provide the mechanical information for the
Quad-Core Intel® Xeon® Processor 5400 Series. The drawing is superseded with the
drawing in the processor datasheet should there be any conflicts. Integrated package/
socket stackup height information is provided in the LGA771 Socket Mechanical Design
Guide.
drawing in the processor datasheet should there be any conflicts. Integrated package/
socket stackup height information is provided in the LGA771 Socket Mechanical Design
Guide.